It excels in adhesion from various metal and plated surfaces to plastic surfaces!
The "AG Series" is a conductive adhesive with low electrical resistance and excellent thermal conductivity. By optimizing the shape of the silver filler, it achieves a low resistance of less than 10^-5 Ωcm and a high thermal conductivity of 60 W/Km. Additionally, it excels in adhesion from various metal surfaces (gold, silver, aluminum, copper) to plastic surfaces, and allows for selection suitable for applications such as low-temperature curing (80°C). 【Features】 ■ Low electrical resistance and excellent thermal conductivity ■ Selection of resins with high adhesion strength available within the series ■ Excellent adhesion from various metal surfaces (gold, silver, aluminum, copper) to plastic surfaces ■ Selection suitable for applications such as low-temperature curing (80°C) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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【Usage】 ■ For semiconductor devices (LED, IC, LSI, MEMS, power devices, etc.) *For more details, please refer to the PDF document or feel free to contact us.
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Ando DK Co., Ltd. develops, manufactures, and sells high-performance adhesives and sealants made from epoxy resin. Ando DK's products prioritize quality control and environmental impact and reliability at every stage of the manufacturing process, from raw material selection to product development, with consideration for the global environment. We aim to continue creating products that are friendly to both people and the environment for the future we want to leave for our children.