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  6. Conductive Adhesive "AG Series"

Conductive Adhesive "AG Series"

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last updated:Nov 04, 2021

アンドウ・ディーケイ 藤沢事業所
アンドウ・ディーケイ 藤沢事業所
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It excels in adhesion from various metal and plated surfaces to plastic surfaces!

The "AG Series" is a conductive adhesive with low electrical resistance and excellent thermal conductivity. By optimizing the shape of the silver filler, it achieves a low resistance of less than 10^-5 Ωcm and a high thermal conductivity of 60 W/Km. Additionally, it excels in adhesion from various metal surfaces (gold, silver, aluminum, copper) to plastic surfaces, and allows for selection suitable for applications such as low-temperature curing (80°C). 【Features】 ■ Low electrical resistance and excellent thermal conductivity ■ Selection of resins with high adhesion strength available within the series ■ Excellent adhesion from various metal surfaces (gold, silver, aluminum, copper) to plastic surfaces ■ Selection suitable for applications such as low-temperature curing (80°C) *For more details, please refer to the PDF document or feel free to contact us.

    glueOther consumables
2021-11-04_13h28_15.png

Conductive Adhesive "AG Series"

2021-11-04_13h28_15.png
2021-11-04_13h28_15.png
  • Related Link - https://www.andodk.co.jp/products.html

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【Usage】 ■ For semiconductor devices (LED, IC, LSI, MEMS, power devices, etc.) *For more details, please refer to the PDF document or feel free to contact us.

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High-performance adhesive sealant

High-performance adhesive sealant

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アンドウ・ディーケイ

アンドウ・ディーケイ 藤沢事業所

Electronic Components and Semiconductors

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Ando DK Co., Ltd. develops, manufactures, and sells high-performance adhesives and sealants made from epoxy resin. Ando DK's products prioritize quality control and environmental impact and reliability at every stage of the manufacturing process, from raw material selection to product development, with consideration for the global environment. We aim to continue creating products that are friendly to both people and the environment for the future we want to leave for our children.

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