アンドウ・ディーケイ Product Lineup

We would like to introduce our heat cation curing sealant and adhesive, the 'TP Series'. This product is a heat cation polymerization type resin that allows you to select the curing temperature from low to high, and has a long working time at room temperature. It can also be stored at 5°C. 【Features】 ■ Heat cation polymerization type resin ■ Curing temperature can be selected from low to high ■ Long working time at room temperature ■ Can be stored at 5°C *For more details, please refer to the PDF document or feel free to contact us.

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The "UV Series" is a light cationic polymer type resin that can be stored at room temperature, used as a UV-curable sealing material and adhesive. It features heat discoloration properties, water resistance, and low curing shrinkage, allowing for energy savings and reduced working time. It is compatible with UV LED light sources (365nm), has no oxygen inhibition, and is a resin with high safety for the human body. 【Features】 ■ Light cationic polymer type resin that can be stored at room temperature ■ Energy savings and reduced working time ■ Heat discoloration properties, water resistance, low curing shrinkage ■ Compatible with UV LED light sources (365nm) ■ No oxygen inhibition, high safety for the human body *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce our insulating adhesive "SI Series." High thermal conductivity types using AIN and BN fillers are also available. We offer a selection of various fillers and shapes, and further optimize resin performance, resulting in excellent low stress and low curing shrinkage. 【Features】 ■ High thermal conductivity types using AIN and BN fillers are also available ■ A selection of various fillers and shapes, and further optimization of resin performance, resulting in excellent low stress and low curing shrinkage *For more details, please refer to the PDF document or feel free to contact us.

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The "AG Series" is a conductive adhesive with low electrical resistance and excellent thermal conductivity. By optimizing the shape of the silver filler, it achieves a low resistance of less than 10^-5 Ωcm and a high thermal conductivity of 60 W/Km. Additionally, it excels in adhesion from various metal surfaces (gold, silver, aluminum, copper) to plastic surfaces, and allows for selection suitable for applications such as low-temperature curing (80°C). 【Features】 ■ Low electrical resistance and excellent thermal conductivity ■ Selection of resins with high adhesion strength available within the series ■ Excellent adhesion from various metal surfaces (gold, silver, aluminum, copper) to plastic surfaces ■ Selection suitable for applications such as low-temperature curing (80°C) *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce our transparent sealing agents and adhesives, the 'OPD/ENP series.' To achieve high adhesion, it is possible to select toughness, hardness, and other properties depending on the target object. In addition to gas barrier properties that block harmful gases contained in exhaust, it also possesses heat resistance, water resistance, and corrosion resistance. 【Features】 ■ Ability to select toughness and hardness depending on the target object to achieve high adhesion ■ Heat resistance, water resistance, and corrosion resistance ■ Gas barrier properties (blocks harmful gases contained in exhaust) ■ Discoloration resistance and light resistance (high light transmittance and maintains transparency for a long time) *For more details, please refer to the PDF document or feel free to contact us.

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Our company is engaged in the development and manufacturing of "high-performance adhesive sealants." Our products prioritize quality control and environmental impact throughout all manufacturing processes, from material selection to product development, with consideration for the global environment and reliability. We offer a wide range of products, including the sealing and adhesive materials "OPD Series/ENP Series" and conductive adhesives "AG Series." 【Features】 ■ High thermal conductivity products ■ Transparent epoxy products that are resistant to discoloration ■ Applications for organic EL and silicon solar cells ■ Product applications: for semiconductor devices (LEDs, ICs, LSIs, MEMS, power devices, etc.) *For more details, please refer to the PDF document or feel free to contact us.

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Ando DK Co., Ltd. is a company that manufactures and sells high-performance adhesives and sealants made from epoxy resin. Ando DK's products prioritize quality control, environmental impact, and reliability throughout all manufacturing processes, from raw material selection to product development, with consideration for the global environment. We aim to continue creating products that are friendly to both people and the environment for the future we want to leave for our children. 【Product Introduction】 ○ Applications: For semiconductor devices (LEDs, ICs, LSIs, MEMS, power devices, etc.) ○ Features: High thermal conductivity products, transparent epoxy products that are resistant to discoloration Applications for organic EL and silicon solar cells For more details, please contact us or download the catalog.

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• Other semiconductors