Ando DK Co., Ltd. Business Introduction

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last updated：May 12, 2015

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Further challenges in adhesives and encapsulants for semiconductors! A small drop supports the forefront of the world.

Ando DK Co., Ltd. is a company that manufactures and sells high-performance adhesives and sealants made from epoxy resin. Ando DK's products prioritize quality control, environmental impact, and reliability throughout all manufacturing processes, from raw material selection to product development, with consideration for the global environment. We aim to continue creating products that are friendly to both people and the environment for the future we want to leave for our children. 【Product Introduction】 ○ Applications: For semiconductor devices (LEDs, ICs, LSIs, MEMS, power devices, etc.) ○ Features: High thermal conductivity products, transparent epoxy products that are resistant to discoloration Applications for organic EL and silicon solar cells For more details, please contact us or download the catalog.

Related Link - http://www.andodk.co.jp/

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**Main Features of the Products** [Transparent Encapsulants and Adhesives: OPD Series, ENP Series] ○ Selection of toughness and advanced properties based on the target object to achieve high adhesion. ○ Heat resistance, water resistance, and corrosion resistance. [Conductive Adhesives: AG Series] ○ Low electrical resistance and excellent thermal conductivity. → By optimizing the silver filler shape, we achieve low resistance below 10⁻⁵Ωcm and high thermal conductivity of 60W/km. [Insulating Adhesives: SI Series] ○ High thermal conductivity types using AIN and BN fillers are also available. ○ Selection of various fillers and shapes, further optimizing resin performance for low stress and excellent low curing shrinkage. [UV-Curable Encapsulants and Adhesives: UV Series] ○ Resin type that allows for room temperature storage with light cationic polymerization. ○ Energy-saving and reduced working time are possible. ○ Thermal discoloration properties, water resistance, and low curing shrinkage. [Thermal Cationic Curing Encapsulants and Adhesives: TP Series] ○ Resin type with thermal cationic polymerization. ○ Curing temperature can be selected from low to high temperatures, allowing for longer room temperature working time. ● For more details, please contact us or download the catalog.