High thermal conductivity types using AIN and BN fillers are also possible! They excel in low stress and low curing shrinkage.
We would like to introduce our insulating adhesive "SI Series." High thermal conductivity types using AIN and BN fillers are also available. We offer a selection of various fillers and shapes, and further optimize resin performance, resulting in excellent low stress and low curing shrinkage. 【Features】 ■ High thermal conductivity types using AIN and BN fillers are also available ■ A selection of various fillers and shapes, and further optimization of resin performance, resulting in excellent low stress and low curing shrinkage *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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【Application】 ■ For semiconductor devices (LED, IC, LSI, MEMS, power devices, etc.) *For more details, please refer to the PDF document or feel free to contact us.
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Ando DK Co., Ltd. develops, manufactures, and sells high-performance adhesives and sealants made from epoxy resin. Ando DK's products prioritize quality control and environmental impact and reliability at every stage of the manufacturing process, from raw material selection to product development, with consideration for the global environment. We aim to continue creating products that are friendly to both people and the environment for the future we want to leave for our children.