Laser Dispense Type BH63J3229G
Using a special activator that enables rapid heating implementation with light. It reduces sagging during heating and solves issues with solder balls.
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basic information
【Specifications】 ■Compatible solder alloy: Sn63-Pb37 ■Flux type: JIS-AA, MIL-RMA ■Halide content: 0.08% ■Powder particle size: 45 to 25μm ■Flux content: 12% ■Copper plate corrosion test: No corrosion ■Copper mirror corrosion test: No corrosion ■Insulation resistance test (Ω): 5.0×10^8Ω or more ■Migration test: No occurrence
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Implementation of automotive electrical components and consumer products.
Detailed information
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Using a special catalyst that enables rapid heating implementation with light. It reduces sag during heating and solves issues with solder balls.
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Company information
Ishikawa Metal Co., Ltd. is a manufacturer and seller of lead-free and lead-containing solder, consistently engaged in solder production since its establishment. In addition to various types of rosin-core solder and solder paste, we also handle high-melting-point solder for semiconductors and flux for semiconductor mounting. We not only manufacture and sell unique solders, such as rosin-core solder for lasers and solder that can be used for aluminum and stainless steel, but we also propose solutions to customer issues such as splattering and wetting defects.