Residue Flow Prevention Type BH63E3021F
Using a flux with high melting viscosity, it is compatible with rapid heating implementation by light. It suppresses the flow out of the flux during heating, resulting in a good appearance after implementation.
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basic information
【Specifications】 ■Compatible solder alloy: Sn63-Pb37 ■Flux type: MIL-RMA ■Halide content: 0.04±0.02% ■Powder particle size: 53-38μm ■Flux content: 11.5±0.5% ■Copper plate corrosion test: No corrosion ■Copper mirror corrosion test: No corrosion ■Insulation resistance test (Ω): 5.0×10^8Ω or more ■Migration test: None detected
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Applications/Examples of results
Implementation of components such as automotive electrical devices, where reliability is required.
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Company information
Ishikawa Metal Co., Ltd. is a manufacturer and seller of lead-free and lead-containing solder, consistently engaged in solder production since its establishment. In addition to various types of rosin-core solder and solder paste, we also handle high-melting-point solder for semiconductors and flux for semiconductor mounting. We not only manufacture and sell unique solders, such as rosin-core solder for lasers and solder that can be used for aluminum and stainless steel, but we also propose solutions to customer issues such as splattering and wetting defects.