Please use the high-speed rotary handler and automatic taping device when needed.
High-speed rotary handler. This device is capable of providing various packages in different packaging forms. It features a unique impulse removal function during device pickup, achieving low cost while emphasizing stability. It can accommodate not only semiconductors but also a variety of solid objects.
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basic information
Specifications: ● Supported package sizes: 1x1 - 12x12 ● Packages: MO/TO, QFN, SOIC, BGA, etc. ● Input: Balls, trays, tapes, tubes, bulk, etc. ● Output: Tapes, reels (options: trays, tubes, bulk, dual tape) ● Dimensions: 1800x1200x960mm etc. For more details, please download the catalog.
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Applications/Examples of results
Power semiconductors, discrete devices, and appearance inspection of small signal systems, as well as packaging equipment. Additionally, various semiconductor package appearance inspections and packaging equipment.
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Company information
A semiconductor inspection equipment manufacturer established in Hangzhou, China in April 2008. We develop and design wafer probers, testers, and handlers, supplying them to major semiconductor manufacturers. In 2017, we were listed on the Shenzhen Stock Exchange in China, established a Taiwan office, and in July 2018, we set up a Japan office. In 2019, we acquired Semiconductor Technologies & Instruments Ptd Ltd, an appearance inspection equipment manufacturer in Singapore, and in September 2020, we absorbed the semiconductor division of Sato Product Co., Ltd., providing better inspection equipment to the market for inspection equipment manufacturers.