Exhibited at SEMICON Japan 2021 Hybrid.

Automatic removal device for defective components of thin film metal processing products. Capable of handling defective components such as VCM springs and lead frames.

A device that automatically removes only defective components detected by Prest Kappar (a thin film metal processing appearance inspection device) by acquiring information about the defective components in combination with CCTECH. Traditionally, the process involved manually obtaining information about the defective components through visual inspection and then mechanically removing them through visual confirmation. By using an automated machine in this process, it eliminates the risk of incorrect removal and significantly shortens the manufacturing process time through automation.

• Other machine tools

Please use this when a high-speed rotary handler is needed.

High-speed rotary handler. This device can provide various packages in different packaging forms. It features a unique impulse removal function with a voice coil during device pickup, achieving low cost while emphasizing stability. It is also capable of handling heating measurements. Not only for semiconductors, but it can also accommodate various solid objects.

• Taping Machine

Please use the high-speed rotary handler and automatic taping device when needed.

High-speed rotary handler. This device is capable of providing various packages in different packaging forms. It features a unique impulse removal function during device pickup, achieving low cost while emphasizing stability. It can accommodate not only semiconductors but also a variety of solid objects.

• Taping Machine

If you need a high-speed rotary handler, please use this EXIS250/300.

High-speed rotary handler. This device can provide various packages in different packaging forms. It features a unique impulse removal function during device pickup, achieving low cost while emphasizing stability. It can accommodate not only semiconductors but also a variety of solid objects.

• Taping Machine

A new technology for active alignment of camera modules significantly improves the throughput of module manufacturing using 3D charts.

Currently, active alignment, which positions the image sensor and lens, uses a 2D chart and employs a method of taking several images to achieve focus. The fundamental principle involves using a 3D chart to align both the front and depth focus simultaneously for lens positioning. This time, we will introduce the 3D chart related to the fundamental principle of active alignment. In this technical handbook, we will cover the following topics: ★ Optical axis of high-performance cameras ★ Methods for optical axis adjustment ★ 3D chart technology ★ Experiments to verify the principles

• Other semiconductors
• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

It can be used for a wide range of applications, from analog semiconductors such as power supply-related ICs, operational amplifiers, and motor drivers to analog-digital mixed ICs.

Tester for electrical characteristic testing of analog mixed ICs. It is characterized by very high accuracy in voltage and current measurements. It can be used for battery monitoring ICs, analog-related products, and analog-digital mixed products.

• Tester
• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

The CTA8280 is an IC tester specialized for analog products. It is characterized by high accuracy in voltage and current measurements.

The CTA8280F is the second generation analog tester from CCTECH. It is ideal for various analog semiconductor applications, including power-related ICs, operational amplifiers, power amplifiers, and motor drivers.

• Tester
• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

CCTECH's custom-made module inspection device. Based on appearance inspection, it can be fully customized to meet customer needs.

The CM2030 is an inspection device designed for the appearance inspection of image sensor camera modules. While it is fundamentally an image sensor, CCTECH's CM series can accommodate various appearance inspections not only for modules but also through customization. Recently, there has been an increase in products that incorporate multiple semiconductor dies within IC packages, such as RF-related semiconductors. This product is capable of inspecting various defects, including wire bonding inspections of the substrate board inside those semiconductor chips, as well as scratches, chips, and other defects.

• Semiconductor inspection/test equipment
• Visual Inspection Equipment
• Circuit Board Inspection Equipment

Inspection of semiconductor defects, unevenness, and stains is handled by a single machine using the same inspection process.

In semiconductor manufacturing processes such as film deposition, resist coating, lithography, etching, and CMP, it is desirable to perform uniform manufacturing processes on each die on the wafer. However, in reality, variations such as foreign matter contamination, pattern defects, and film thickness lead to inconsistencies on the wafer. By incorporating automated inspection equipment into each of these processes, fine adjustments to the semiconductor process operations can be made. Furthermore, not only for semiconductor wafers but also for metal etching products, defects and distortions are inspected visually. However, as the quantity of these processed products increases, the likelihood of oversight in visual inspections and the labor costs can become significantly inflated. To reduce these oversights and labor costs, we introduce Prestige into the inspection processes of semiconductor and metal etching products, enabling cost reductions from oversight in the inspection process. 【Features】 ● High-resolution specification of 7μm and high-throughput specification of 38μm pixel resolution, accommodating a wide range of inspections ● RGB three-color LED lighting for optimized illumination according to patterns ● Adjustable camera angles for inspecting bright field to dark field images ● Simultaneous processing of defect inspection and uniformity inspection ● Compatible with 6/8/12-inch wafers ● Optional features for backside wafer inspection

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment
• Visual Inspection Equipment

To achieve low cost and high precision, we are switching from Japanese manufacturers' testers to overseas manufacturers' testers.

Recently, amid whispers about the supply of power semiconductors, production lines in factories are being strengthened. As various semiconductor manufacturing equipment is used, the products manufactured must ultimately undergo testing of their electrical characteristics. Japan, which is also a large market for power semiconductors, is currently facing a situation where the prices of testers themselves are not decreasing, even though electrical characteristic testers are supplied by Japanese manufacturers. CCTECH's CTT3700 enables testing of MOSFETs, diodes, voltage regulators, and IGBT devices compatible with 2000V/100A, achieving lower prices by developing and manufacturing overseas compared to the prices previously offered by traditional domestic Japanese manufacturers.

• Tester
• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

A device that extracts dies from wafers after dicing and transfers them to tape/reel while inspecting the dies. It is capable of inspection using visible light and infrared light.

tSort is a semiconductor sorting device that extracts dies from diced wafers/film frames and transfers them to tape/reels while inspecting the dies. It is capable of inspection using visible light and infrared light. 【Features】 ● 8”, 12”, diced wafers/film frames (WLCSP, BGA, eWLB, QFN, COG, etc.) ● Taping, compatible with JEDEC/canisters ● Throughput: 40,000 pph ● Inspection items - Co-planarity inspection of dies/solder balls/bumps - Bump defect detection - IR, infrared appearance inspection - 5-sided inspection - Die size - Dicing line edge inspection - Marking inspection - Scratch and foreign matter inspection

• Taping Machine
• Binding/Packing Machine
• Visual Inspection Equipment

It is a semiconductor sorting device that extracts dies from dicing wafers and transfers them to tape/reels or trays while inspecting the dies.

This is a semiconductor sorting device that performs visual inspection of the 5th and 6th sides of diced wafers, and transfers them to taping, reels, or trays. It is difficult to visually inspect the dies after dicing, so an automatic machine inspects for scratches and debris, determines good and defective products, and facilitates the transfer. 【Features】 ● Compatible with 8”, 12”, and diced wafers/film frames (WLCSP, BGA, eWLB, QFN, etc.) ● Supports taping and JEDEC/waffle trays ● Throughput: pph 20K ● Inspection items: - Co-planarity inspection of dies/solder balls/bumps - 5-side inspection - Die size - Cut line edge inspection - Marking inspection - Scratch and foreign matter inspection

• Taping Machine
• Binding/Packing Machine
• Visual Inspection Equipment

Using two inspection cameras for semiconductor wafer inspection equipment, the tact time has been reduced by half. 3D bump inspection is also possible.

Using patented OTF (On the Fly) technology and two inspection cameras to simultaneously capture bright and dark fields, the inspection process time is reduced by half. Additionally, 3D inspections are possible, enabling the inspection of coplanarity for bumps used in WLSCP packages and others.

• Tester
• Semiconductor inspection/test equipment
• Visual Inspection Equipment

Hexa EVO+ is a device that inspects both the front and back sides of semiconductor IC packages and packages them for taping and other purposes.

Hexa EVO+ is a device for inspecting 3D appearance defects on both sides of semiconductor IC packages, ball arrays, leads, etc., and automatically packaging dies, IC sorting, and handler appearance inspection. It can accommodate a variety of inspection items and various packages. 【Features】 ● Appearance inspection for packages under 100mm ● Throughput, UPH90K ● Dual taping output support ● Automatic position correction ● Defective component management ● Appearance inspection contents ・3D front and back appearance inspection ・Ball and pad inspection ・Front, back, and side appearance inspection ・Package thickness inspection ・Color inspection ・Crack inspection

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment
• Binding/Packing Machine

Semiconductors, dies, package sorters. This is a device that performs visual inspection after extracting from tubes, trays, and taping/reels, and then repackages them.

AT468 is a semiconductor, die, and package sorter that supports various input and output types. It is a device that performs visual inspection after extracting from tubes, trays, and taping/reels, and then packages them into tubes, trays, and taping/reels.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment
• Binding/Packing Machine

Cost-reduction model of Prestige II developed specifically for 8-inch wafers. It is capable of simultaneously inspecting defects and irregularities on the wafer.

PRESTIGE V is a budget version of the existing PRESTIGE II. The size of the device has been reduced by 50%, making it more space-efficient. The camera angle is set during the evaluation stage and fixed at the time of factory shipment. Although there are limitations on wafer size, it inherits the inspection capabilities of the PRESTIGE II as a budget version product.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment
• Visual Inspection Equipment

Power semiconductor tester for low-voltage discrete devices at Si level. Increases throughput by testing 16 sites simultaneously.

CTT3280F is ideal for testing discrete power semiconductors such as MOSFETs and diodes. By using 16 sites simultaneously, it is possible to increase throughput. The supported voltage is up to 1000V/10A. Test programs can be developed in C language, making it easy to create programs.

• Tester
• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

The CS series is a handler for memory, designed for Pick & Place type substrates.

The CS series is a handler for memory and is designed for Pick & Place type substrates.

• Semiconductor inspection/test equipment
• Substrate transport device (loader/unloader)
• Other conveying machines

A significantly downsized and lower-priced ultra-low-cost prober compared to conventional probers.

This is a space-saving type of prober that has been downsized from the conventional size. It significantly improves throughput and utilizes optical technology for wafer alignment. Additionally, by efficiently accessing prober functions and testing functions through test applications, it greatly reduces the software development period.

• Tester
• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

CCTECH's custom-made module inspection equipment. Based on appearance inspection, it can be fully customized to meet customer needs.

The CM8200 is an inspection device that supports the appearance inspection of fingerprint authentication modules and enables testing of certain electrical characteristics. Essentially a fingerprint authentication sensor, the CCTECH CM series can be customized to accommodate various appearance inspections, not just limited to modules. Recently, there has been an increase in products that incorporate multiple semiconductor dies within IC packages, such as RF-related semiconductors. This product can inspect all defects, including wire bonding inspections of the substrate board inside those semiconductor chips, as well as scratches and chips.

• Visual Inspection Equipment
• Defect Inspection Equipment
• Circuit Board Inspection Equipment

A device that transports parts to semiconductor inspection equipment. It is a gravity-based transport device. It is capable of performing transport and appearance inspection simultaneously.

To transport parts to semiconductor inspection equipment, throughput is an important selection criterion. CCTECH's C8 and C9 series are gravity-based transport devices and handlers. The C8 series is for transport only, while the C9 series supports both transport and appearance inspection. The appearance inspection uses two cameras to inspect the appearance of semiconductor packages.

• Tester
• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Although I have heard that verification efficiency at the RTL stage improves with verification methodologies using SystemVerilog such as UVM, many designers may not fully understand what can be done with SystemVerilog and how to use it. In this seminar, we will introduce the basic functions and usefulness of SystemVerilog verification using a sample design. 1. Design Overview 2. UART Test Environment 3. Assertions (SVA & PSL) 4. Functional Coverage 5. Random Test Bench 6. DPI-C

The RTCA/DO-254 guidance recommends that applicants define and implement HDL coding standards. This work begins with a planning process that includes the definition of the standard, how it will be implemented, and, if the process is automated, the evaluation methods for tools or results. A key issue is that the guidance does not have clearly defined formal standards, leading to questions about how to conduct a detailed review of HDL code. In this webinar, we will demonstrate the use of ALINT-PRO to enforce coding standards and highlight the benefits of streamlining the overall design review to meet the objectives of DO-254.

[Speaker] Takahiro Tachikawa, President of International University and Professor at the Graduate School of International Management [Key Lecture Content] In February of this year, the 7th Energy Basic Plan was approved by the Cabinet. What is the essence of this plan that the media and others do not convey? How will this plan impact the development and social implementation of hydrogen, ammonia, and next-generation fuels (synthetic methane, synthetic liquid fuels, green LP gas, etc.)? This lecture will delve into these points. In particular, it will focus on the content of the risk scenario, which is viewed as the main scenario among stakeholders in the energy industry, and the newly defined role of natural gas as an "important energy source even after achieving carbon neutrality." [Lecture Items] 1. The 7th Energy Basic Plan 2. Hydrogen 3. Ammonia 4. Synthetic Fuels 5. Risk Scenario 6. Natural Gas Shift 7. Q&A / Business Card Exchange

[Lecturer] Professor Shiro Kawabata, Faculty of Science and Technology, Hosei University [Key Lecture Content] Prime Minister Ishiba has positioned 2025 as the inaugural year for the industrialization of quantum technology and has indicated a policy to strengthen support for the industrialization of quantum technology. Additionally, at the G7 Summit held in Canada in June 2025, a joint statement titled "Joint Statement on the Future of Quantum Technology," focusing on quantum technology centered around quantum computers, was adopted. Quantum computers are computers that utilize principles of quantum mechanics, such as superposition and quantum entanglement, for information processing. By using quantum computers, it becomes possible to solve several mathematical problems, such as factorization, machine learning, quantum chemistry calculations, finance, and linear simultaneous equations, exponentially faster compared to classical computers. As a result, major global corporations and startups are globally expanding their development and business in quantum computer hardware and software. This seminar will introduce the basics of quantum computers, the latest research and development trends, business trends, technical challenges, and future prospects.

[Speaker] Shintaro Kobayashi, Group Manager, ICT and Content Industry Consulting Department, Nomura Research Institute, Ltd. [Key Lecture Content] The Personal Information Protection Law is undergoing fundamental changes to promote AI development. The Personal Information Protection Commission has proposed a shift towards a risk-based system where companies voluntarily address risks. A key feature of this new system is the establishment of a framework that allows the use of personal information for AI development without the need for individual consent. In this lecture, based on the policy of legal reform, we will carefully explain the points for advancing data utilization by leveraging the legal benefits of the new system, as well as how to establish privacy governance that should drive these efforts, incorporating specific initiatives and examples of solutions. [Lecture Items] 1. Trends in the amendment of the Personal Information Protection Law 2. Practical methods for utilizing personal information without individual consent 3. PETs for safely utilizing AI 4. Achieving governance efficiency and sophistication through AI 5. Q&A / Business card exchange