Semiconductors, dies, package sorters. This is a device that performs visual inspection after extracting from tubes, trays, and taping/reels, and then repackages them.
AT468 is a semiconductor, die, and package sorter that supports various input and output types. It is a device that performs visual inspection after extracting from tubes, trays, and taping/reels, and then packages them into tubes, trays, and taping/reels.
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basic information
● Tube, JEDEC tray, ball feeder, taping/reel compatible ● Compatible packages: SOIC, QFN, TSSOP, MEMS, etc. ● Inspection items 〇 Lead defects with exposed copper and other materials 〇 Marking and appearance defect inspection 〇 5-sided inspection of 2D/3D leads and pads using two cameras 〇 Front and back appearance inspection 〇 8 test sites within the equipment
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Applications/Examples of results
This is used in cases where semiconductors packaged in tape or other materials are re-inspected and repackaged into different forms such as trays. It supports various packaging forms for both input and output, and also accommodates a variety of semiconductor packages, including SOIC, QFN, TSSOP, and MEMS-related packages.
Detailed information
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AT468, semiconductor inspection, packaging equipment.
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Company information
A semiconductor inspection equipment manufacturer established in Hangzhou, China in April 2008. We develop and design wafer probers, testers, and handlers, supplying them to major semiconductor manufacturers. In 2017, we were listed on the Shenzhen Stock Exchange in China, established a Taiwan office, and in July 2018, we set up a Japan office. In 2019, we acquired Semiconductor Technologies & Instruments Ptd Ltd, an appearance inspection equipment manufacturer in Singapore, and in September 2020, we absorbed the semiconductor division of Sato Product Co., Ltd., providing better inspection equipment to the market for inspection equipment manufacturers.