Hexa EVO+ is a device that inspects both the front and back sides of semiconductor IC packages and packages them for taping and other purposes.
Hexa EVO+ is a device for inspecting 3D appearance defects on both sides of semiconductor IC packages, ball arrays, leads, etc., and automatically packaging dies, IC sorting, and handler appearance inspection. It can accommodate a variety of inspection items and various packages. 【Features】 ● Appearance inspection for packages under 100mm ● Throughput, UPH90K ● Dual taping output support ● Automatic position correction ● Defective component management ● Appearance inspection contents ・3D front and back appearance inspection ・Ball and pad inspection ・Front, back, and side appearance inspection ・Package thickness inspection ・Color inspection ・Crack inspection
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This is a device used for packaging semiconductors at a semiconductor manufacturer, where visual inspections are conducted before packaging. It is used for 3D visual inspections of components such as balls and leads.
Detailed information
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Automatic taping and appearance inspection device.
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A semiconductor inspection equipment manufacturer established in Hangzhou, China in April 2008. We develop and design wafer probers, testers, and handlers, supplying them to major semiconductor manufacturers. In 2017, we were listed on the Shenzhen Stock Exchange in China, established a Taiwan office, and in July 2018, we set up a Japan office. In 2019, we acquired Semiconductor Technologies & Instruments Ptd Ltd, an appearance inspection equipment manufacturer in Singapore, and in September 2020, we absorbed the semiconductor division of Sato Product Co., Ltd., providing better inspection equipment to the market for inspection equipment manufacturers.
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