It is a semiconductor sorting device that extracts dies from dicing wafers and transfers them to tape/reels or trays while inspecting the dies.
This is a semiconductor sorting device that performs visual inspection of the 5th and 6th sides of diced wafers, and transfers them to taping, reels, or trays. It is difficult to visually inspect the dies after dicing, so an automatic machine inspects for scratches and debris, determines good and defective products, and facilitates the transfer. 【Features】 ● Compatible with 8”, 12”, and diced wafers/film frames (WLCSP, BGA, eWLB, QFN, etc.) ● Supports taping and JEDEC/waffle trays ● Throughput: pph 20K ● Inspection items: - Co-planarity inspection of dies/solder balls/bumps - 5-side inspection - Die size - Cut line edge inspection - Marking inspection - Scratch and foreign matter inspection
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It is used in cases where wafers are diced, inspected for each die, and then packaged in trays or taped before being shipped to customers. It is necessary to inspect for scratches and contamination during the dicing process using automated machines, and it is used for that purpose.
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STI iSort
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Company information
A semiconductor inspection equipment manufacturer established in Hangzhou, China in April 2008. We develop and design wafer probers, testers, and handlers, supplying them to major semiconductor manufacturers. In 2017, we were listed on the Shenzhen Stock Exchange in China, established a Taiwan office, and in July 2018, we set up a Japan office. In 2019, we acquired Semiconductor Technologies & Instruments Ptd Ltd, an appearance inspection equipment manufacturer in Singapore, and in September 2020, we absorbed the semiconductor division of Sato Product Co., Ltd., providing better inspection equipment to the market for inspection equipment manufacturers.