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  6. Razer Kappar Metal Processing Products Defective Material Automatic Removal Device

Razer Kappar Metal Processing Products Defective Material Automatic Removal Device

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last updated:Nov 18, 2021

CCTECH Japan CCTECH Japan(株)-  日本法人
CCTECH Japan CCTECH Japan(株)-  日本法人
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Automatic removal device for defective components of thin film metal processing products. Capable of handling defective components such as VCM springs and lead frames.

A device that automatically removes only defective components detected by Prest Kappar (a thin film metal processing appearance inspection device) by acquiring information about the defective components in combination with CCTECH. Traditionally, the process involved manually obtaining information about the defective components through visual inspection and then mechanically removing them through visual confirmation. By using an automated machine in this process, it eliminates the risk of incorrect removal and significantly shortens the manufacturing process time through automation.

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Razer Kappar Metal Processing Products Defective Material Automatic Removal Device

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basic information

● Work Types: Metal processing products such as copper and stainless steel (flat processed products), VCM springs, and leaf springs. ● Work Size: Dimensions: ~300x600mm (can exceed 300x600mm depending on options) Thickness: 10um~ (consultation required for laser output adjustment) ● Laser Removal Method: 3D Scan / Fiber Laser ● Throughput: 120 sheets/h (at 200x500mm) ● Others: Automatic removal of defective areas through communication with Prest Kapper (Defect Management System)

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Applications/Examples of results

Removal of defective components in the VCM spring used in mobile phone camera modules Removal of defective components in the lead frame

Detailed information

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    Razer Kappar

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Razer Kappar Metal Processing Product Defect Material Removal Device

Razer Kappar Metal Processing Product Defect Material Removal Device

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Exhibited at SEMICON Japan 2021 Hybrid.

  • Seminar・Event

Our company will be exhibiting at "SEMICON Japan 2021 Hybrid," which will be held at Tokyo Big Sight from December 15 (Wednesday) to December 17 (Friday), 2021. We are a semiconductor inspection equipment manufacturer headquartered in China. The company was established in 2008 in China, and we began full-scale sales activities in Japan in October 2020. This will be our first exhibition at SEMICON Japan. We look forward to your visit.

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CCTECH

CCTECH Japan CCTECH Japan(株)-  日本法人

Industrial Electrical Equipment

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A semiconductor inspection equipment manufacturer established in Hangzhou, China in April 2008. We develop and design wafer probers, testers, and handlers, supplying them to major semiconductor manufacturers. In 2017, we were listed on the Shenzhen Stock Exchange in China, established a Taiwan office, and in July 2018, we set up a Japan office. In 2019, we acquired Semiconductor Technologies & Instruments Ptd Ltd, an appearance inspection equipment manufacturer in Singapore, and in September 2020, we absorbed the semiconductor division of Sato Product Co., Ltd., providing better inspection equipment to the market for inspection equipment manufacturers.

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Defect inspection device and defect removal device for thin film metal processing products.
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Defect inspection device and defect removal device for thin film metal processing products.

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