Using two inspection cameras for semiconductor wafer inspection equipment, the tact time has been reduced by half. 3D bump inspection is also possible.
Using patented OTF (On the Fly) technology and two inspection cameras to simultaneously capture bright and dark fields, the inspection process time is reduced by half. Additionally, 3D inspections are possible, enabling the inspection of coplanarity for bumps used in WLSCP packages and others.
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basic information
★ By using two transport arms, it is possible to use the entire wafer and the diced wafer without any hardware changes. ★ The use of two cameras simultaneously reduces the inspection process tact time by half. ★ 3D inspection checks the coplanarity of bumps used in WLCSP packages and others. ★ Automatic defect review function ★ Automatic correction of wafer misalignment
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Applications/Examples of results
Visual inspection of semiconductor front-end and back-end processes Visual inspection for foreign objects, cracks, particles, and chipping Inspection of package bump coplanarity
Detailed information
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★ By using two transport arms, it is possible to use the entire wafer and the diced wafer without any hardware modifications. ★ By using two cameras simultaneously, the takt time of the inspection process is halved. ★ 3D inspection checks the coplanarity of bumps used in WLCSP packages and others. ★ Automatic defect review function. ★ Automatic correction of wafer misalignment.
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Company information
A semiconductor inspection equipment manufacturer established in Hangzhou, China in April 2008. We develop and design wafer probers, testers, and handlers, supplying them to major semiconductor manufacturers. In 2017, we were listed on the Shenzhen Stock Exchange in China, established a Taiwan office, and in July 2018, we set up a Japan office. In 2019, we acquired Semiconductor Technologies & Instruments Ptd Ltd, an appearance inspection equipment manufacturer in Singapore, and in September 2020, we absorbed the semiconductor division of Sato Product Co., Ltd., providing better inspection equipment to the market for inspection equipment manufacturers.
![[Technical Data Presentation] High-speed and High-precision Camera Inspection Technology using 3D Charts](https://image.mono.ipros.com/public/product/image/48c/2000603111/IPROS32900498003788666277.png?w=280&h=280)
