A significantly downsized and lower-priced ultra-low-cost prober compared to conventional probers.
This is a space-saving type of prober that has been downsized from the conventional size. It significantly improves throughput and utilizes optical technology for wafer alignment. Additionally, by efficiently accessing prober functions and testing functions through test applications, it greatly reduces the software development period.
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basic information
● Prober dimensions: 1,620 x 1,240 mm ● Compatible wafers: 8", 12" ● Compatible die sizes: 350um ~ 76,000um ● Probing area: ±170mm (-155mm-200mm) ● Index time: 250ms (for 6x6mm die size) ● Equipped with pre-alignment and OCR unit for throughput improvement ● Equipped with digital zoom camera ● APC (Auto Probe Changer) ● Supports Class 10
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Applications/Examples of results
It is a prober necessary for performing electrical tests by pinning on dies on wafers, such as sensor-related products, analog mixed products, and microcontrollers. It can be used for a wide range of semiconductor products.
Detailed information
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Semiconductor prober
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Company information
A semiconductor inspection equipment manufacturer established in Hangzhou, China in April 2008. We develop and design wafer probers, testers, and handlers, supplying them to major semiconductor manufacturers. In 2017, we were listed on the Shenzhen Stock Exchange in China, established a Taiwan office, and in July 2018, we set up a Japan office. In 2019, we acquired Semiconductor Technologies & Instruments Ptd Ltd, an appearance inspection equipment manufacturer in Singapore, and in September 2020, we absorbed the semiconductor division of Sato Product Co., Ltd., providing better inspection equipment to the market for inspection equipment manufacturers.
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