[Development Case] Watchdog Reset IC

Successfully miniaturized the IC, contributing to the suppression of increased substrate size! Adopted a compact, thin, bottom-mounted package.

In car navigation systems, the diversification of functions has led to an increase in the number of components. To implement all components on a limited circuit board, it has become necessary to consolidate and miniaturize each component. Our company uses wafer processes suitable for the product's application, achieving miniaturization of chip sizes without compromising quality. Furthermore, we have adopted a small, thin, bottom-mounted package (Plating Lead Package) from the existing SOP package. As a result, we have successfully achieved more than a 50% reduction in both chip size and package size compared to existing products, contributing to the suppression of circuit board size increases due to the rise in the number of components. [Effects] - Successfully achieved more than a 50% reduction in both chip size and package size compared to existing products. - Contributed to the suppression of circuit board size increases due to the rise in the number of components. *For more details, please refer to the PDF document or feel free to contact us.

Other semiconductors