I will introduce the void in the implementation with solder paste.
Void Issues Voids in solder joints are phenomena where gas generated during soldering remains trapped inside the solder joint. According to the industry standard IPC-A-610, voids up to 25% of the joint area are permissible, but for components such as power devices, reducing voids is necessary to improve heat dissipation efficiency and ensure joint reliability. Causes of Voids The causes of voids include: - Air bubbles trapped in non-wet areas - Decomposition gases from residual flux in the solder - Decomposition gases trapped in non-wet areas Measures Against Voids To prevent voids, it is essential to avoid creating non-wet areas on the substrate and components. It is important to manage them properly to prevent deterioration due to oxidation or moisture absorption during storage. Our company offers void-reducing solder paste made from materials with good wettability and low gas generation, so please contact us for more information.
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Ishikawa Metal Co., Ltd. is a manufacturer and seller of lead-free and lead-containing solder, consistently engaged in solder production since its establishment. In addition to various types of rosin-core solder and solder paste, we also handle high-melting-point solder for semiconductors and flux for semiconductor mounting. We not only manufacture and sell unique solders, such as rosin-core solder for lasers and solder that can be used for aluminum and stainless steel, but we also propose solutions to customer issues such as splattering and wetting defects.