Frequently Asked Questions about Thin Film Circuit Boards (Carrier and Submount)
We introduce frequently asked questions about thin film circuit substrates (carrier and submount)!
Here are some frequently asked questions about the "thin film circuit boards (carrier/submount)" that we handle. Starting with "What kind of metal is the metal thin film?" and including questions like "What is the composition of the solder? (types)" and "What kinds of films can be made with metals?" we provide answers to many inquiries. Feel free to use this information for product selection, and don't hesitate to contact us for more details. 【Excerpt of Questions】 ■ What kind of metal is the metal thin film? ■ What is the composition of the solder? (types) ■ What methods can be used for patterns? ■ What types of substrates can be prepared? ■ What kinds of equipment are available? *For more details, please refer to the related links or feel free to contact us.
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【Other Questions (Excerpt)】 ■Could you tell us about your main customers? ■Can you apply a metal film to glass as well? ■Is it possible to provide support using supplied substrates? ■What types of films can you create with metals and other materials? ■What methods do you use to create films? *For more details, please refer to the related links or feel free to contact us.
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【Applications】 ■ Optical storage ■ Projectors ■ Optical communication ■ Consumer industry ■ Lighting *For more details, please refer to the related links or feel free to contact us.
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The area where Citizen Fine Devices demonstrates its strength is in the realm of functional components that require small size, precision, high accuracy, and high detail. We believe that our mission is to continue providing high-value-added microdevice products by leveraging the unique technologies we have developed over many years. Utilizing metal processing technology rooted in watch manufacturing, we have consistently supplied small, high-precision components to our customers for many years through a fully integrated production line that encompasses process design, machining, assembly, and functional testing, along with the unique development of our own processing machines. Additionally, mass-producing components with high precision and efficiency using brittle materials is also one of our core technologies. By integrating material technology with ultra-precision machining, thin-film technology, and bonding technology, we produce not only high-precision components such as ceramics and quartz but also high-quality functional device products like liquid crystal devices and sensing devices. Continuing to provide high-value-added products to the market is a significant dream for our employees. We will contribute to the creation of new value through manufacturing driven by the challenge spirit of each individual, working towards the realization of that dream.
