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  1. Home
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  3. Measurement and Analysis
  4. Testing Equipment and Devices
  5. Environmental Test Equipment
  6. New Counter-Target Sputtering (NFTS) Device

New Counter-Target Sputtering (NFTS) Device

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last updated:Nov 25, 2021

トヤマ
トヤマ
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For applications in superconducting thin films and MEMS, it is possible to deposit films on organic substrates with low damage and low-temperature film formation.

The New Facing Targets Sputtering (NFTS) technology is a film deposition technique characterized by its principle and structure that can suppress damage to the deposited substrate caused by the impact of energy species (recoiled particles, ions, electrons) by confining high-density plasma in a box-shaped space. With NFTS technology, it is possible to form high-quality thin films at low temperatures and with low damage, which was considered difficult with conventional sputtering techniques, making it a film deposition technology with high production capabilities. **Features** - **Opposing Target Structure** - Plasma confinement between opposing targets → Suppression of high-energy particles to the substrate → Low-damage film deposition → Suppression of a large number of electrons to the substrate (suppression of Joule heating) → Low-temperature film deposition - **Box-Shaped Plasma Source** - Separation of the vacuum chamber and plasma source → Realization of miniaturization of the entire device through the downsizing of the vacuum chamber → Improved operability and maintainability of the device *For more details, please refer to the PDF document or feel free to contact us.*

    Other machine elementsOther physicochemical equipmentEnvironmental Test Equipment
2021-11-25_09h48_51.png

New Counter-Target Sputtering (NFTS) Device

2021-11-25_09h48_51.png
2021-11-25_09h48_51.png
  • Related Link - https://www.toyama-jp.com/nfts/

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【Other Features】 ■Magnet Arrangement at the Target Outer Edge - Plasma formation at the target outer edge → Increased erosion area → Improved target utilization efficiency → Uniform plasma formation on large targets → Compatible with large substrates - Improvement of the target cooling mechanism → Increased maximum input power → Enhanced film deposition rate → Suppression of degradation of magnetic field forming magnets → Improved long-term stability of the device *For more details, please refer to the PDF document or feel free to contact us.

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【Applications】 ■ Plastic film coating field ■ Organic thin film application field ■ Multilayer optical thin film application field ■ Various passivation film fields ■ Semiconductor device application field ■ Magnetic thin film application field ■ Superconducting thin film application field ■ MEMS application field *For more details, please refer to the PDF document or feel free to contact us.

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Film Formation Device Comprehensive Catalog

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トヤマ

トヤマ

Testing, Analysis and Measurement

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Toyama Corporation is a company built through the blood and sweat of its founder, Motomasa Endo, who was a craftsman dedicated to helping researchers striving for scientific and technological exploration, even at the cost of his own wealth. Our company can be seen as a dojo for refining humanity. We sharpen our sensitivity to polish ourselves and continuously seek the destiny of ourselves, society, our country, and humanity. In this process, we strive to develop scientific and technological advancements that will surely illuminate our path, particularly those that can contribute to world peace. While this may sound grand, there are indeed things that anyone can do. At our company, we consider and continue to practice contributions to these goals through "monozukuri" (manufacturing).

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