SOI prototype and contract manufacturing services (wafer grinding, polishing, and bonding)
Prototype support, small quantity support, 4 to 8 inch support, customizable thickness and shape, PCB arrangement possible, support for supplied PCBs, short delivery time.
SOI wafers are silicon wafers with a structure that forms a single crystal silicon layer on an oxide film, used in a wide range of fields such as high-speed LSI, low-power LSI, power devices, and MEMS. In addition to standard SOI, we also offer specialized SOI wafers such as Cavity SOI wafers and Thick-BOX SOI wafers. <Supported Range> ■ Supported Sizes: 6" 8" ■ Active Layer Thickness: 100nm to 200μm ■ In-Plane Thickness Accuracy: Thin Film ±15nm to Thick Film ±0.5μm ■ BOX Layer Thickness: Up to 20μm 【Examples of Features of Various SOI Wafers】 ■ Reduction of manufacturing steps for MEMS devices ■ Improvement of yield rates ■ Reduction of post-dicing processes ■ Early realization of high-voltage semiconductor power devices *For more details, please download the PDF or feel free to contact us.
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Seiren Adbvanced Materials Corp. provides various film deposition processing services for silicon wafers, focusing on oxide films, to customers around the world. Our representative product, the thick thermal oxide film, is shipped to customers globally as an essential material for optical communication components, which are experiencing market expansion in areas such as 5G and data centers. Additionally, we offer SOI wafers that achieve high quality and short delivery times, with production capabilities that can accommodate everything from prototypes (small lots) to mass production for MEMS and power semiconductors. We aim to continue contributing to society broadly through silicon wafer film deposition processing and to be an indispensable company for our customers.
