セーレンアドバンストマテリアルズ Product Lineup

Since our establishment, we have consistently processed oxide films on silicon wafers. We can accommodate everything from small lot prototypes to large-scale production quantities. Additionally, we offer thick film processing that cannot be matched by other companies, ensuring we meet all of our customers' needs. In particular, our unique thick film thermal oxidation film formation technology has become an essential material for optical devices that support optical communications, and our products and technologies are adopted by communication equipment manufacturers and optical component manufacturers worldwide.

• Wafer

SOI wafers are silicon wafers with a structure that forms a single crystal silicon layer on an oxide film, used in a wide range of fields such as high-speed LSI, low-power LSI, power devices, and MEMS. In addition to standard SOI, we also offer specialized SOI wafers such as Cavity SOI wafers and Thick-BOX SOI wafers. <Supported Range> ■ Supported Sizes: 6" 8" ■ Active Layer Thickness: 100nm to 200μm ■ In-Plane Thickness Accuracy: Thin Film ±15nm to Thick Film ±0.5μm ■ BOX Layer Thickness: Up to 20μm 【Examples of Features of Various SOI Wafers】 ■ Reduction of manufacturing steps for MEMS devices ■ Improvement of yield rates ■ Reduction of post-dicing processes ■ Early realization of high-voltage semiconductor power devices *For more details, please download the PDF or feel free to contact us.

• Wafer

KST's network is spread around the world to meet customer needs for silicon wafers, quartz wafers, compound wafers, glass substrates, and more. Of course, we also offer custom-made solutions. We propose the most cost-effective products tailored to your application, and since we provide them based on quality evaluations conducted in our own clean room, our customers can use them with peace of mind.

• Wafer

At Seiren KST Co., Ltd., in addition to our own oxide film processing, we provide various film deposition processes and various film-coated wafers related to semiconductor manufacturing processes through partner companies for research and development purposes. <Supported Sizes> 4 inch to 12 inch *We can accommodate all types of processing, but depending on the wafer size, there may be limitations on processing capabilities, so please contact us for more details.

• Wafer processing/polishing equipment
• Wafer