Examples of narrow-pitch MEMS mounting on flexible substrates and flexible circuit board implementations.
We would like to introduce a case study of our response to system and set manufacturers. Even if you have a concept for an IoT system or set, you may be facing challenges such as not knowing the implementation methods or materials to use, OSAT not being able to accommodate structures other than assembly line setups or small-scale production, and lacking a partner for process development that involves equipment development. As a result, we conducted narrow-pitch MEMS mounting on flexible substrates, flexible substrate mounting, and stress measurement for solder flip chips. [Case Summary (Excerpt)] ■ Narrow-pitch MEMS mounting on flexible substrates - Created flexible substrate design and implemented NCP/ACP mounting - Achieved miniaturization ■ Low-temperature 80℃ flexible substrate mounting *For more details, please refer to the PDF document or feel free to contact us.
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【Other Case Overview】 ■Solder Flip Chip Stress Measurement - Stress measurement chip solder flip chip mounting - Measurement environment setup - Stress conversion, customer reporting *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Connectec Japan Co., Ltd. is a process development-oriented semiconductor backend contract OSRDA that creates new packages through its core technologies, bump-on-material and damage-free bonding, known as MONSTER PAC. If you are facing challenges with semiconductor chip assembly or MEMS chip manufacturing and assembly, please consult us first. Our experienced development team will respond to any of your requests.