We will introduce examples of equipment development and low-temperature 80°C chip bonding to narrow-pitch PET substrates.
We would like to introduce a case study of our response to equipment manufacturers. When developing new process equipment, they faced challenges such as a lack of knowledge and development resources regarding the process, and the desire to sell the process and equipment as a package, but having processes that they do not own in-house. As a result, we conducted equipment development and low-temperature 80°C chip bonding for narrow-pitch PET substrates. [Case Overview] ■ Equipment Development - Equipment development tailored to specifications and budget requests. ■ Low-Temperature 80°C Chip Bonding for Narrow-Pitch PET Substrates - 27.5μm pitch wiring and bump formation (by Komori Corporation) - Low-temperature 80°C flip chip mounting *For more details, please refer to the PDF document or feel free to contact us.
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Connectec Japan Co., Ltd. is a process development-oriented semiconductor backend contract OSRDA that creates new packages through its core technologies, bump-on-material and damage-free bonding, known as MONSTER PAC. If you are facing challenges with semiconductor chip assembly or MEMS chip manufacturing and assembly, please consult us first. Our experienced development team will respond to any of your requests.