Customization for each customer is supported! Additional features can be added even after the equipment has been installed.
The "LJ-24-PD3" is a product designed for ultra-flat and high surface roughness processing, allowing for rough finishing, medium finishing, and ultra-mirror finishing by changing the material of the lapping plate. With the variable speed control knob, it is possible to adjust the rotation speed during the lapping process. The load on the workpiece is managed by a lifting unit that automatically raises and lowers a dead weight, reducing the burden on the operator. A PLC sequencer is used for control, accommodating customization for each customer. 【Features】 - Reduces the burden on the operator - Implements safety measures to prevent hand pinching - Allows for millimeter-level position adjustments even during processing - Enables free adjustment of the workpiece's rotational and orbital speeds - Additional expansion functions can be added even after the device is installed, thanks to the 32-bit I/O *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Specifications (Partial)】 ■ Wrapping plate diameter: φ610 ■ Work holder ring diameter: Outer diameter φ287 × Inner diameter φ247 ■ Work holder ring rotation method: Forced drive mechanism ■ Number of machining axes: 3 axes ■ Pressurization method: Dead weight lifting cylinder ■ Control method: PLC sequencer control *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company offers a wide range of services including the manufacturing and sales of polishing equipment, consumable materials, machine design, electrical design and production, equipment maintenance, and contract polishing processing. We have accumulated extensive experience, including lapping and polishing of semiconductors, compound semiconductors, and oxides, allowing us to propose polishing processes to our users.