Achieving high-precision grinding! Equipped with multi-stage steps, capable of handling complex grinding recipes.
The LGP-612 is a product that supports the development of high-precision technology equipped with a dual polishing head compatible with wafers ranging from φ4" to φ8". The polishing plate uses ultra-flat alumina ceramics. The polishing head features a mechanism that allows for one-touch replacement, and by employing a low-friction cylinder, it enhances pressure responsiveness. 【Features】 ■ Achieves high-precision polishing with a spindle designed for increased rigidity that can withstand uneven loading ■ The polishing plate uses ultra-flat alumina ceramics ■ Adopts high-precision, high-rigidity LM guides to reduce vibrations, which are uncertain factors during processing ■ Allows for individual input of "pressure" and "rotation speed" for both axes (heads) ■ Supports complex polishing recipes *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications】 ■Polish plate diameter: φ620mm ■Polish plate rotation speed: 20–120 min-1 ■Work head diameter: φ4" or φ6" or φ8" ■Pressing capacity: 0.008–0.03 MPa ■Oscillation stroke: 60mm (fixed) ■Oscillation speed: 0–10 strokes/min ■Main body dimensions (excluding protrusions): 1,200(W) × 1,200(D) × 2,100(H) mm *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company offers a wide range of services including the manufacturing and sales of polishing equipment, consumable materials, machine design, electrical design and production, equipment maintenance, and contract polishing processing. We have accumulated extensive experience, including lapping and polishing of semiconductors, compound semiconductors, and oxides, allowing us to propose polishing processes to our users.