Improvement of work parallelism! It is possible to de-bubble air and other contaminants that were mixed in during wafer attachment.
The "LTP-250" is a product that allows for vacuum degassing during wax application. It enables the uniformity and thinning of the wax film. By applying the wax in a vacuum state, it is possible to degas bubbles contained in the wax and air that may have been trapped during the application of warped wafers. 【Effects of the application process】 ■ Improved parallelism of the workpiece ■ Enhanced flatness of the polished surface ■ Uniformity of the wax film thickness ■ Thinning of the film ■ Improvement of film distortion *For more details, please refer to the PDF document or feel free to contact us.
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【Lineup】 ■LTP-250 ■LTP-300 ■LTP-500 *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company offers a wide range of services including the manufacturing and sales of polishing equipment, consumable materials, machine design, electrical design and production, equipment maintenance, and contract polishing processing. We have accumulated extensive experience, including lapping and polishing of semiconductors, compound semiconductors, and oxides, allowing us to propose polishing processes to our users.