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  6. McDarmid Power Electronics Argomax

McDarmid Power Electronics Argomax

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McDermid Performance Solutions Japan Co., Ltd.

last updated:Sep 26, 2025

セイワ 東京本社、関西支社、名古屋営業所、中国無錫  グループ会社 エレクトロン(長野県松本市)
セイワ 東京本社、関西支社、名古屋営業所、中国無錫  グループ会社 エレクトロン(長野県松本市)
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Apply sintering binders and sintering processes! This can dramatically expand design possibilities.*

Established in 1872, this American manufacturer has a global network and a wide range of adoption records based on world unified quality standards. In Japan, we also have a lab in Kanagawa (Hiratsuka) that supports everything from prototype condition setting to after-sales service after mass production begins, allowing customers to utilize various facility equipment themselves. "Power Electronics" is a sintering process solution using "Argomax" aimed at significantly improving power cycle test performance. By applying sintering adhesives and the sintering process, it is possible to dramatically expand the design possibilities of our products. Using film-type products, sintering adhesives can be transferred to chips and clips. 【Features】 ■ Enables sintering at low pressure through the application of unique nanotechnology ■ Allows bonding of packages and coolers using flat dispense methods ■ Enables transfer of sintering adhesives at the wafer level using film-type products ■ In preform-type products, the bonding thickness can be customized ■ Sintering onto solid copper substrates is possible *For more details, please refer to the PDF materials or feel free to contact us.

    glue
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McDarmid Power Electronics Argomax

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  • Seiwa-McDermid Co., Ltd. Introduction Page
  • Special site - Product/service details - https://pr.mono.ipros.com/seiwa-tr/product/

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basic information

【Argomax Product Lineup】 ■DAS: Die Attach ■TAS: Chip-on-Board Bonding ■PAS: Package Bonding ■WAS: Wafer-Level Sintering Adhesive *For more details, please refer to the PDF document or feel free to contact us.

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Applications/Examples of results

Alpha Argomax sintering adhesive enables the manufacturing of SiC/GaN power modules/devices with a Tjmax of over 200°C, contributing to improved reliability of chip bonding and overall cost reduction. It is ideal for inverters aimed at hybrid vehicles, EVs, power transmission, railways, and more. It can also accommodate lead-free high-reliability bonding. *For more details, please refer to the PDF document or feel free to contact us.

Detailed information

  • スクリーンショット

    We offer a variety of pastes, films, and preforms to suit different applications.

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セイワ

セイワ 東京本社、関西支社、名古屋営業所、中国無錫  グループ会社 エレクトロン(長野県松本市)

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The development of electronics has given people great dreams and has turned those dreams into reality, one by one. This development has been passed on to the 21st century, inspiring even greater dreams and hopes. I am deeply grateful and delighted to have been able to engage in work that contributes to this segment of the electronics industry. Moving forward, I will continue to serve as a conduit for the appropriate information on semiconductors and electronic components, so that I can help realize humanity's great dreams and support the product and information development of our clients. I am committed to walking alongside our clients and growing together in the information society of the 21st century. However, on the other hand, global environmental issues have become increasingly prominent. As a member of society, I feel the importance of leaving a rich natural environment for the future and preserving the fundamental value of humanity. I am determined to strive towards becoming a company that harmonizes with nature and society as we move towards an endless future.

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