McDarmid Power Electronics Argomax
McDermid Performance Solutions Japan Co., Ltd.
Apply sintering binders and sintering processes! This can dramatically expand design possibilities.*
Established in 1872, this American manufacturer has a global network and a wide range of adoption records based on world unified quality standards. In Japan, we also have a lab in Kanagawa (Hiratsuka) that supports everything from prototype condition setting to after-sales service after mass production begins, allowing customers to utilize various facility equipment themselves. "Power Electronics" is a sintering process solution using "Argomax" aimed at significantly improving power cycle test performance. By applying sintering adhesives and the sintering process, it is possible to dramatically expand the design possibilities of our products. Using film-type products, sintering adhesives can be transferred to chips and clips. 【Features】 ■ Enables sintering at low pressure through the application of unique nanotechnology ■ Allows bonding of packages and coolers using flat dispense methods ■ Enables transfer of sintering adhesives at the wafer level using film-type products ■ In preform-type products, the bonding thickness can be customized ■ Sintering onto solid copper substrates is possible *For more details, please refer to the PDF materials or feel free to contact us.
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【Argomax Product Lineup】 ■DAS: Die Attach ■TAS: Chip-on-Board Bonding ■PAS: Package Bonding ■WAS: Wafer-Level Sintering Adhesive *For more details, please refer to the PDF document or feel free to contact us.
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Alpha Argomax sintering adhesive enables the manufacturing of SiC/GaN power modules/devices with a Tjmax of over 200°C, contributing to improved reliability of chip bonding and overall cost reduction. It is ideal for inverters aimed at hybrid vehicles, EVs, power transmission, railways, and more. It can also accommodate lead-free high-reliability bonding. *For more details, please refer to the PDF document or feel free to contact us.
Detailed information
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We offer a variety of pastes, films, and preforms to suit different applications.
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The development of electronics has given people great dreams and has turned those dreams into reality, one by one. This development has been passed on to the 21st century, inspiring even greater dreams and hopes. I am deeply grateful and delighted to have been able to engage in work that contributes to this segment of the electronics industry. Moving forward, I will continue to serve as a conduit for the appropriate information on semiconductors and electronic components, so that I can help realize humanity's great dreams and support the product and information development of our clients. I am committed to walking alongside our clients and growing together in the information society of the 21st century. However, on the other hand, global environmental issues have become increasingly prominent. As a member of society, I feel the importance of leaving a rich natural environment for the future and preserving the fundamental value of humanity. I am determined to strive towards becoming a company that harmonizes with nature and society as we move towards an endless future.