McDarmid Adhesives for Power Electronics
ALPHA Algomax Atrox PowerBond TrueHeight
We offer a variety of new joining materials suitable for chip bonding, including heat-resistant fatigue solder and EV materials.
MacDermid Performance Solutions has finally begun to seriously address the lead-free transition of high melting point solders, which had previously been excluded due to the lack of suitable solder materials. At the same time, there is a demand for bonding materials that can fully leverage the capabilities of next-generation power semiconductors. Alpha Argomax sinter paste is a bonding material that can meet both of these challenging requirements. Alpha Assembly Solutions is also focusing on the development of high thermal conductivity epoxy pastes.
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basic information
**Argomax Sinter Paste** Alpha Argomax Sinter Paste enables the manufacturing of SiC GaN power module devices with a Tjmax of over 200°C, contributing to improved reliability of chip bonding and overall cost reduction. **Features** - Improved bonding reliability: More than 5-10 times that of solder bonding - Low-pressure sintering process: Improved yield - Shortened bonding process time: Increased productivity **Atrox Conductive Paste** Alpha Atrox Conductive Paste is suitable for various die attach applications and can be used as a pressureless hybrid sintering agent. Its high thermal conductivity (10-100 W/mK) enables the realization of lead-free solder packages. **PowerBond Series** - Tjmax = 175°C - Ideal for chip bonding and heat sink bonding Power Bond 2050 - Melting point: 235-240°C Power Bond 2110 - Melting point: 222-266°C **True Height** Solder preform
Price information
Please contact Seiwa Co., Ltd.
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Applications/Examples of results
Power semiconductors (including logic) Power discrete LED & laser Power modules High-power semiconductors, etc. They are particularly suitable for inverters for hybrid vehicles, EVs, power transmission, railways, etc.
Detailed information
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We offer a variety of pastes, films, and preforms to suit different applications.
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The development of electronics has given people great dreams and has turned those dreams into reality, one by one. This development has been passed on to the 21st century, inspiring even greater dreams and hopes. I am deeply grateful and delighted to have been able to engage in work that contributes to this segment of the electronics industry. Moving forward, I will continue to serve as a conduit for the appropriate information on semiconductors and electronic components, so that I can help realize humanity's great dreams and support the product and information development of our clients. I am committed to walking alongside our clients and growing together in the information society of the 21st century. However, on the other hand, global environmental issues have become increasingly prominent. As a member of society, I feel the importance of leaving a rich natural environment for the future and preserving the fundamental value of humanity. I am determined to strive towards becoming a company that harmonizes with nature and society as we move towards an endless future.