Achieving high-precision plating with technology cultivated through precision mold processing! Mass production of lead frames that accommodate multi-pin and narrow pitch designs.
We would like to introduce the "lead frames" that we handle. They cater to various needs such as LSI, transistors, and diodes. We provide a consistent response from mold design and manufacturing to assembly and production, enabling mass production, and we have established a stable supply system in collaboration with our overseas bases. Additionally, we can offer a wide variety of high-precision plating processes, including spot silver plating, palladium plating, and barrel gold plating, according to our customers' requests. 【Features】 ■ Extremely small punching width of 80μm ■ Advanced mold development and manufacturing, along with stamping mass production technology to meet various needs ■ Responding to various lead frame requirements ■ Stable supply system in collaboration with overseas bases *For more details, please refer to the PDF document or feel free to contact us.
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【Other Features】 ■ Stamping Process - The mass production equipment for lead frames has a large-scale production system, both in Japan and overseas. - With ample capacity, we always respond quickly to customer requests. ■ Plating Process - We offer a wide variety of high-precision plating processes, including spot silver plating, palladium plating, and barrel gold plating. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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The products made by Rohm Mechatronics are the foundational components for semiconductor manufacturing.