Thermal Conductive Filler【GAPFILLER】

In recent years, the importance of thermal management has been increasing to efficiently dissipate heat in components that are miniaturized or require high current. Therefore, Matsumoto Processing is proposing a two-component curing thermal conductive filler. This material can be automatically applied at room temperature using a dispenser, can be easily compressed to any desired thickness, and flexibly conforms to the unevenness of components. It reacts and cures within a few hours after application, and after curing, it becomes a solid material with flexibility, eliminating concerns about pump-out during long-term use. This product is expanding its applications in filling gaps between heat-generating components and heat sinks, as well as between heat-generating substrates and aluminum cases. Please feel free to contact us.

In recent years, especially in E-Mobility such as BEV/HEV and 5G communication devices, the demand for efficient thermal management, including heat dissipation of electronic components and batteries, has been increasing. Our company offers gap fillers to achieve high-efficiency heat exchange between heat-generating components and heat-dissipating components. Please take a look.