For those struggling with selecting positioning stages. You can find out which positioning stages are used in which processes! We will also introduce key points for selecting equipment.
This document presents usage records for each semiconductor manufacturing process. We introduce positioning stages used in the pre-process and post-process leading to completion, starting with the high-load goniometer "wire saw" for ingot positioning. Additionally, it can be utilized in devices that measure the thickness and surface shape of various samples, not just semiconductor wafers. 【Featured Products (Partial)】 ■ Wire Saw ■ Wafer Bonding Equipment ■ Exposure Equipment for Printed Circuit Boards ■ Film Thickness and Composition Measurement Equipment ■ Laser Dicing *For more details, please refer to the PDF document or feel free to contact us.
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[Featured Products (Partial)] ■ Probe card inspection equipment ■ Photomask manufacturing equipment ■ Probe processing equipment ■ Surface shape measurement system Dyvoce ・ Manual machine, sheet type ・ Automatic machine, CtoC *For more details, please refer to the PDF document or feel free to contact us.
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We offer a full range of positioning solutions required for nano-level high-precision positioning, image processing alignment, semiconductor inspection, optical device assembly, and automotive camera production.