The wafer size supports up to 12 inches. Consultations for chip sizes below 0.5mm are also available. It accommodates the formation of stud bumps in various shapes.
Our company offers "flip chip mounting," which can reduce the mounting area compared to conventional wire bonding. In the formation of stud bumps, we can customize the shape according to specifications. We are equipped to handle large wafers up to 12 inches. We possess extensive know-how and can accommodate inquiries for chip sizes below 0.5mm. We can also provide proposals that include processes following flip chip mounting. 【Features】 ■ Supports 6-inch, 8-inch, and 12-inch wafers ■ Capable of forming two-tier bumps for stud bumps ■ Supports bare wafers, tape-mounted wafers, and reconstructed wafers ■ Accommodates bump leveling *For more details, please refer to the materials. Feel free to contact us with any inquiries.
Inquire About This Product
basic information
Regarding flip chip implementation, we offer a variety of methods in addition to GGI (Gold to Gold Interconnection), allowing us to provide proposals tailored to our customers' needs.
Price range
Delivery Time
Applications/Examples of results
*For more details, please refer to the materials. Feel free to contact us as well.*
catalog（1）
Download All Catalogs
Company information
Estakaya Electronics Co., Ltd. has contributed to the development of an information-oriented society through the development and manufacturing of LSI (Large Scale Integration) devices and modules. Currently, we are also engaged in the manufacturing and sales of unique development products utilizing our long-cultivated technology and know-how, as well as the sale and service of environmental products to the local community. In the future, we will further respond to the diverse needs of our customers in an evolving society, from the development of original LSI device and module products to the establishment of production systems, as well as the creation of custom-made equipment and tools.