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  6. [Analysis Example by EDS] Bonding Interface of Cu Pad

[Analysis Example by EDS] Bonding Interface of Cu Pad

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last updated:Jun 26, 2025

アイテス
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It is possible to view the distribution of each element in two dimensions! This can also be effective when analyzing multilayer samples.

We would like to introduce a case study of EDS analysis at the Cu pad interface. In qualitative analysis (point analysis) and semi-quantitative analysis of intermetallic compounds, the concentration of contained elements is calculated by examining the intensity (count numbers) of each characteristic X-ray. For intermetallic compounds, it is possible to estimate the formed compounds based on the calculated concentration ratios. Additionally, in line analysis, it is possible to profile the concentration distribution of each element along a specified line in the SEM image, allowing for the observation of changes in element concentration at the analysis location. 【Features of EDS Analysis】 ■ Qualitative analysis (point analysis) and semi-quantitative analysis of intermetallic compounds - Concentration of contained elements is calculated by examining the intensity (count numbers) of each characteristic X-ray - Intermetallic compounds can be estimated based on the calculated concentration ratios ■ Line analysis - Concentration distribution of each element along a specified line in the SEM image can be profiled - Changes in element concentration at the analysis location can be confirmed *For more details, please refer to the PDF document or feel free to contact us.

    Analytical Equipment and DevicesContract Analysis
EDS_2.png

[Analysis Example by EDS] Bonding Interface of Cu Pad

EDS_2.png
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  • Related Link - http://www.ites.co.jp/analyze.html
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【Features of Other EDS Analyses】 ■Surface Analysis - Allows for a two-dimensional view of the distribution of each element - It is also possible to display images with multiple overlapping elements *For more details, please refer to the PDF document or feel free to contact us.

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[Analysis case by EDS] Bonding interface of Cu pad

[Analysis case by EDS] Bonding interface of Cu pad

TECHNICAL
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Energy Dispersive X-ray Spectroscopy (EDS)

Energy Dispersive X-ray Spectroscopy (EDS)

PRODUCT
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Total support service for cross-section grinding, processing, observation, and analysis.

Total support service for cross-section grinding, processing, observation, and analysis.

OTHER
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Cross-sectional observation of copper terminals and elemental analysis using SEM/EDX.

Cross-sectional observation of copper terminals and elemental analysis using SEM/EDX.

TECHNICAL
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Detection sensitivity due to differences in acceleration voltage during SEM-EDX analysis.

Detection sensitivity due to differences in acceleration voltage during SEM-EDX analysis.

TECHNICAL
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Changes due to differences in acceleration voltage during EDX analysis.

Changes due to differences in acceleration voltage during EDX analysis.

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アイテス

アイテス

Electronic Components and Semiconductors

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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