Achieved high purity of 65nμm / 5 pieces! Inserted 25 pieces into the gaps of 25 Wf to create a half pitch and processed 50 pieces at once.
The "300mm Cassette-less Wafer Cleaning System" is a product used in the chemical polishing process after final polishing. It processes 50 wafers at a time by placing 25 wafers in the gaps of 25 wafers in a half-pitch arrangement, achieving a high cleanliness level of 65nμm/5 pieces. 【Main Specifications】 ■ Items to be cleaned: 300mm thickness 0.75t ■ Processing method: Cassette-less dip processing ■ Processing speed: 50 pieces/5 min (variable) ■ Cleanliness inside the device: 0.1μm Class 1 ■ Pass line: FL+900±5mm manual set with a hoop ■ Transport method: Front transport *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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【Usage】 ■Chemical polishing process after final polishing *For more details, please refer to the PDF document or feel free to contact us.
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Dan Science Co., Ltd. focuses on cleaning technology, purification technology, and measurement technology, particularly centered around clean technology. We look to the future from a wide range of perspectives and continue to create new products that leverage our development spirit since our founding. We carry out a consistent process from manufacturing to inspection of ultra-cleaning devices, air purification devices, and vacuum devices in a clean environment. Please feel free to contact us if you have any inquiries.
