Used in the chemical polishing process after final polishing / Batch processing of 50 pieces / Achieving high purity of 19nμm/5 pieces
<Equipment Overview> This device is used in the chemical polishing process after final polishing. Its feature is that it places 25 wafers in the gaps of 25 wafers, creating a half pitch, allowing for the simultaneous processing of 50 wafers. It achieves a high purity of 19nμm / 5 pieces.
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basic information
<Main Specifications> 1. Item to be cleaned: 300mm thickness 0.75t 2. Processing method: Dip processing without cassette 3. Processing speed: 50 sheets/5min (variable) 4. Cleanliness inside the device: 0.1μm Class 1 5. Pass line: FL+900±5mm manual set by hoop 6. Conveyance method: Front conveyance
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Applications/Examples of results
Chemical polishing process after final polish
Company information
This brand name was chosen to signify the creation of highly unique products with the aim of "EXTENSIVE VISION ON SYSTEM." Current technological innovations are remarkable, and the demands of the times are constantly becoming more advanced. We believe that it is our mission at Zebios to contribute to the industry by consistently proposing differentiated equipment that will revolutionize the now-mature equipment industry.
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