株式会社ダン科学 Product Lineup

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It enables transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.

• Other cleaning machines
• Ultrasonic Cleaner
• Other semiconductor manufacturing equipment

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Simultaneous cleaning of both sides is possible ■ Wafer types for cleaning: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8” (thickness to be discussed) ■ Supports transparent wafers as well *For more details, please contact us or download and view the catalog.

• Other cleaning machines
• Ultrasonic Cleaner
• Other semiconductor manufacturing equipment

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing is also performed. ■ Capable of simultaneous cleaning of both sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8” (thickness to be discussed) ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.

• Other cleaning machines
• Ultrasonic Cleaner
• Other semiconductor manufacturing equipment

This is a single-chamber device that performs various sizes and types of wafer cleaning, including surfactants, pure water scrubbing, chemical spraying, megasonic spot showering, and spin drying. It is a space-saving model that allows for complete cleaning within a single cleaning layer, making it suitable for areas with limited space. Please consult us regarding single-function scrub cleaning devices. 【Features】 ■ Cleaning, rinsing, and drying can be done in one location ■ Wafer types to be cleaned: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ4”, φ6” to φ8” *For more details, please contact us or download the catalog for further information.

• Other semiconductor manufacturing equipment
• Other cleaning machines
• Ultrasonic Cleaner

A single-wafer device that performs the processes of surfactant and pure water scrub cleaning, chemical spraying, megasonic spot shower, and spin drying all in one chamber. ◇ Space-saving design that completes all processes in a single chamber ◇ Compatible with various wafers including Si (silicon), LT (lithium tantalate), and SiC (silicon carbide) ◇ Removal of foreign substances (organic and inorganic) and metal ions ◇ Flexible adaptation to changes in cleaning items and equipment configuration *For more details, please contact us or download the catalog to view.

• Other semiconductor manufacturing equipment
• Other cleaning machines
• Ultrasonic Cleaner

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It enables transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing cleaning is also performed. ■ Simultaneous cleaning of both sides is possible ■ Wafer types to be cleaned: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Supports transparent wafers as well *For more details, please contact us or download the catalog for more information.

• Other cleaning machines
• Ultrasonic Cleaner
• Other semiconductor manufacturing equipment

A cleaning nozzle unit that requires less water and is less likely to form a water film, which can also be retrofitted to existing equipment. A cleaning nozzle that operates at a maximum of 30Hz. A pump that generates high-pressure water of 5 to 10 MPa. A combination of control units. Conventional continuous spraying applies pressure over a self-created water film, which tends to increase cleaning power = increase pressure = increase flow rate, resulting in a thicker water film. However, the DP-Gun uses intermittent spraying, which means that even at the same pressure (impact), the flow rate is lower, making it less likely to form a water film, and the sprayed water directly impacts the target object. By repeatedly applying intermittent spray impacts, it demonstrates excellent cleaning effects for removing foreign substances from the items being cleaned, cleaning masks, and cleaning three-dimensional objects such as cassettes (with narrow grooves and complex shapes). The pump unit achieves stable water pressure control with minimal waste water during pressure adjustment by performing feedback control that matches flow rate changes due to nozzle opening and closing. *Please consult us regarding spraying a fixed amount of liquid and spray application measurements. *Nozzles and pumps require regular maintenance.

• Other cleaning machines
• Food Cleaning Equipment
• High pressure cleaner

This is a cleaning device that performs the cleaning of various boxes using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling the cleaning to drying process. 【Features】 ■ Cleaning adapted to complex shapes such as hoops ■ Automation of the cleaning process ensures stable cleaning effects *For more details, please contact us or download the catalog to view.

• Other semiconductor manufacturing equipment
• Other cleaning machines
• Ultrasonic Cleaner

This is a cleaning device that performs cleaning of various FOSBs using a high-pressure pulse jet while maintaining a constant distance from the object being cleaned with a multi-joint robot. It is capable of handling the cleaning to drying process. *For more details, please contact us or download and view the catalog.*

• Other semiconductor manufacturing equipment
• Other cleaning machines
• Ultrasonic Cleaner

This is a cleaning device that performs cleaning of various boxes using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling both the cleaning and drying processes. *For more details, please contact us or download the catalog to view it.*

• Other semiconductor manufacturing equipment
• Other cleaning machines
• Ultrasonic Cleaner

This is a cleaning device that performs cleaning of various carriers (cassettes) using high-pressure pulse jets while maintaining a constant distance from the object being cleaned with a multi-joint robot. It is capable of handling processes from cleaning to drying. *For more details, please contact us or download the catalog to view it.*

• Other semiconductor manufacturing equipment
• Other cleaning machines
• Ultrasonic Cleaner

This is a dispersion and scattering device for particles that has developed a dry scattering technology for the spacer scattering process in liquid crystal displays, capable of handling nanoparticles as well. It controls the amount of scattering based on feedback control derived from the amount of charge during scattering. A fixed multiplexer nozzle is used, allowing for uniform particle scattering in all directions simply by switching the air without moving the nozzle. Additionally, by applying a high voltage to the wall surface, it suppresses particle adhesion to the wall, improving particle utilization efficiency and ensuring uniform dispersion performance even for larger workpieces. This tabletop scattering machine is designed for research and development and prototyping, accommodating work sizes of approximately 100mm×100mm to 300mm×300mm. (It is also possible to manufacture mass production equipment for large glass sizes such as 1500mm×1500mm and for inline applications.) *For more details, please contact us.

• LCD display
• Touch Panel
• Powder Supply Device

This is a dispersion and spraying device for particles that has developed dry spraying technology for the spacer scattering process in liquid crystal displays, capable of handling nanoparticles as well. It controls the amount of spraying based on feedback control derived from the charge amount during spraying. A fixed multiplexer nozzle is used, allowing for uniform particle dispersion in all directions by simply switching the air without moving the nozzle. Additionally, by applying high voltage to the wall surfaces, it suppresses particle adhesion to the walls, improving particle utilization efficiency and ensuring uniform dispersion performance even for larger workpieces. This tabletop spraying machine is designed for research and development and prototyping, accommodating workpiece sizes ranging from approximately 100mm x 100mm to 300mm x 300mm. (It is also possible to manufacture mass production equipment for large glass sizes such as 1500mm x 1500mm and for inline applications.) *For more details, please contact us.

• LCD display
• Touch Panel
• Powder Supply Device

A cleaning nozzle unit that requires less water and is less likely to create a water film, which can be retrofitted to existing equipment. A cleaning nozzle that operates at a maximum of 30Hz. A pump that generates high-pressure water of 5 to 10 MPa. A combination with a control unit. Conventional continuous spraying applies pressure over the water film it creates, leading to an increase in cleaning power, which means higher pressure, increased flow rate, and thicker water film. However, the DP-Gun uses intermittent spraying, resulting in lower flow rates at the same pressure (impact), making it less likely to form a water film and allowing the sprayed water to directly impact the target object. By repeatedly applying intermittent spray impacts, it demonstrates excellent cleaning effects for removing foreign substances from the items being cleaned, cleaning masks, and cleaning three-dimensional objects such as cassettes (with narrow grooves and complex shapes). The pump unit achieves stable water pressure control with minimal waste water during pressure adjustments by performing feedback control in accordance with flow rate changes caused by the opening and closing of the nozzle. *Please consult us regarding spraying a fixed amount of liquid and measuring + spray application. *Nozzles and pumps require regular maintenance.

• Other cleaning machines
• Food Cleaning Equipment
• High pressure cleaner

This is a dispersion and spraying device for particles that has developed a dry spraying technology for the spacer scattering process in liquid crystal panel manufacturing, capable of handling nanoparticles as well. The control of the spraying amount is achieved through feedback control based on the amount of charge during spraying. A fixed multiplexer nozzle is used, allowing for uniform particle dispersion in all directions without moving the nozzle. Additionally, by applying high voltage to the wall surfaces, it suppresses particle adhesion to the walls, improving particle utilization efficiency and ensuring uniform dispersion performance even for larger-sized workpieces. It accommodates applications from research and development uses of approximately 100 to 200 mm square to mass production devices like G6 size. (We can also propose and manufacture inline devices combined with cluster cleaners, inspection devices, etc.) It is capable of spraying large particle spacers of 20 to 30 μm, as well as processes for dimming glass and smart glass. Please feel free to consult us regarding particle procurement and other inquiries. *For more details, please contact us.*

• LCD display
• Touch Panel
• Powder Supply Device

This is a single-wafer cleaning device that removes polishing slurry after polishing using disk scrub cleaning, followed by chemical spray, megasonic spot shower, and spin drying. It is capable of removing stubborn residues and metal contamination through chemical spraying, and can also accommodate simultaneous scrub cleaning of the edge as an option. ■ Simultaneous cleaning of both sides and edges is possible ■ Target wafers: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ4” (thickness negotiable) ■ Supports transparent wafers as well *For more details, please contact us or download and view the catalog.

• Other cleaning machines
• Ultrasonic Cleaner
• Other semiconductor manufacturing equipment

The "300mm Cassette-less Wafer Cleaning System" is a product used in the chemical polishing process after final polishing. It accommodates 25 wafers in the gaps of 25 wafers, arranged in a half-pitch, allowing for the simultaneous processing of 50 wafers, achieving a high cleanliness level of 65nμm/5 pieces. 【Main Specifications】 ■ Items to be cleaned: 300mm thickness 0.75t ■ Processing method: Cassette-less dip processing ■ Processing speed: 50 pieces/5 min (variable) ■ Cleanliness inside the device: 0.1μm Class 1 ■ Pass line: FL+900±5mm manual set by hoop ■ Transport method: Front transport *For more details, please refer to the PDF document or feel free to contact us.

• Other cleaning machines

This product is a device that automatically transports and etches GaAs wafers using a dedicated basket. When GaAs wafers placed in the basket from the loader section are introduced, they are automatically transported by a conveyor from the loader section to the etching tank, rinsing tank, and unloader section. Additionally, there is a chemical supply tank located at the bottom of the device, which automatically mixes the chemicals and supplies the required amount to the etching tank. 【Main Specifications】 ■ Heated Material: GaAs (Gallium Arsenide) Block ■ Cassette: Dedicated PTFE Cassette ■ Conveyor: Automatic Robot Transport (Servo Motor Driven) ■ Control Method: Sequencer Control *For more details, please refer to the PDF document or feel free to contact us.

• Etching Equipment

The "IR Drying Oven" is a product that processes items using tact transport via roller conveyance. By heating the substrates after cleaning and air blowing, it evaporates the moisture on the substrates and implements drying. Glass substrates are heated and dried using a clean far-infrared heater (Class 100). 【Main Specifications】 ■ Heated Item: TFT Glass Panel (2880×3130×0.6t) ■ Processing Method: Tact transport via roller conveyance (6° incline) ■ Processing Speed: 75mm/s (Tact Time: 56sec) ■ Heating Conditions: Glass surface temperature reaches 70 ℃ or higher ■ Pass Line: FL+1800±25mm *For more details, please refer to the PDF document or feel free to contact us.

• Drying Equipment
• Heating device

This is an introduction to the "processing equipment for OLED" that our company handles. We provide cleaning equipment for organic EL manufacturing lines. The substrate size we process is 370×470×1.1. The equipment consists of incoming cleaning, pure water cleaning, developing equipment, stripping equipment, Cr etching equipment, and ITO etching equipment. 【Main Specifications】 ■ Items to be cleaned: Glass substrate 370×470 thickness 0.6–1.1t ■ Processing method: Single sheet processing ■ Processing speed: 0.6–5.0m/min (variable) ■ Pass line: FL + 1100mm *For more details, please refer to the PDF document or feel free to contact us.

• Other cleaning machines
• Etching Equipment

We would like to introduce our "Cassette Cleaning Device for PDP." This automatic cleaning device transports PDP substrates using a cassette, which is subjected to a hot water high-pressure shower, liquid drainage, and hot air drying. It is designed and manufactured to fit the specific cassette. The cleaning method involves pure water high-pressure washing combined with hot air drying. 【Main Specifications】 ■ Heated Object: PDP Cassette (2800W × 4700D × 1500H) Weight: 1000kg ■ Cleaning Method: Pure water high-pressure washing + hot air drying ■ Processing Speed: 100mm/s (Tact Time: 28min) ■ Heating Conditions: 100℃ ±5℃ ■ Pass Line: FL + 2400 *For more details, please refer to the PDF document or feel free to contact us.

• Other cleaning machines

This product is a device designed for cleaning Si nuggets. Containers with the workpieces (Si nuggets) are transferred to a dedicated cleaning basket and automatically transported within the cleaning equipment. After that, the basket undergoes chemical polishing, acid etching, and high-quality water rinsing, during which the workpieces are cleaned. At this time, the cleaning basket is agitated to improve cleaning efficiency. After cleaning, the workpieces are transferred to a dedicated drying basket and pre-dried with hot air at 150°C. 【Main Specifications】 ■ Items to be cleaned: Si nuggets ■ Treatment method: Water rinse ⇒ Chemical cleaning ⇒ Rinse ⇒ Pre-drying ■ Transport method: Automatic transport by a transport robot ■ Chemicals used: Hydrofluoric acid, Nitric acid *For more details, please refer to the PDF document or feel free to contact us.

• Other cleaning machines

The "DAN-3502" is an incubator equipped with a high vibration-damping performance and an integrated inbound and outbound robot. It automatically stores crystallization plates after dispensing into a constant temperature container (incubator), retrieves the crystallization plates from the incubator for automatic observation, and is capable of saving the data as images in an integrated system. X-ray protein crystallography is conducted through a series of steps: protein expression, purification, crystallization, X-ray diffraction experiments, and data processing. 【Features】 ■ Supports automatic transport requiring vibration resistance, such as in protein crystallization research ■ Mechanism that prevents vibrations from the built-in robot and freezer from reaching the plates ■ Gentle handling with a non-grip scooper ■ Supports shelf information management and barcode management ■ Prioritizes internal atmosphere with double doors at the entry and exit gates to block outside air ■ Other specifications such as capacity, size, and controlled temperature and humidity range can be customized *For more details, please refer to the PDF document or feel free to contact us.

• incubator
• Thermostatic chamber

We would like to introduce our "Wafer Transfer Device." With two carrier handlers on the left and right, it enables high-speed transport of 1 to 6 carriers. The alignment of the orifice can be switched between upper and lower alignment using a switch. The device can invert wafers in even-numbered rows at the center, while inversion of odd-numbered rows is optional. 【Main Specifications】 ■ Target wafers: Dedicated machines for 4, 5, or 6 inches ■ Number of transfer carriers: 1 to 6 (customizable) ■ Orifice alignment: Switchable (upper alignment, lower alignment) ■ Transfer time: Within 9 minutes for 6 carriers ■ Device dimensions: 1600mm x 725mm x 1450mm (for 4-inch specification) ■ Device weight: 150kg ■ Power supply: AC100V, 15A *For more details, please refer to the PDF document or feel free to contact us.

• Other conveying machines

We would like to introduce our "Frit Drying Furnace." This drying device is used for drying frit paste applied to glass panels and can be manufactured to fit the glass size. The processing speed is 15m/min (36m/min), and it consists of a drying furnace and a cooling section, processing PDP glass in a two-row roller conveyor format, ranging from 42" (964×570) to 50" (1150×680). 【Main Specifications】 ■ Heated Material: Paste applied to PDP glass panels ■ Processing Method: Tactile transport via roller conveyor (1 stage x 2 rows) ■ Processing Speed: 15m/min (36m/min) ■ Heating Conditions: Glass surface temperature 95℃±15℃ for over 44 seconds (guaranteed value) ■ Pass Line: FL+1150±30mm *For more details, please refer to the PDF document or feel free to contact us.

• Drying Equipment

We would like to introduce our "Mask Glass Cleaning Device." The mask glass is stored in an original cassette and cleaned using SPM and a neutral detergent + US, followed by drying with warm water. The process is carried out in the following order: LD → Underwater → SPM → Rinse → Rinse → Neutral Detergent + US → Rinse + US → Rinse → SC-1 → Rinse → Rinse + MUS → Rinse → Warm Water Lift → ULD. 【Main Specifications】 ■ Conveying Direction: Left → Right ■ Passline: 400mm (LD, ULD) ■ Substrate Mask: min 9”×9” to max 24”×24” ■ Main Body Dimensions (Material) ・PVC Wrapped (Ivory): 8000W×2350D×2600H (2900H) ・Frame: Made of SUS304 *For more details, please refer to the PDF document or feel free to contact us.

• Other cleaning machines

We would like to introduce the "Yutaka Drying Device" that we handle. The device dries 25 sheets of Wf in a cassette using the principle of surface tension and slow lifting. By controlling the lifter and liquid level, it ensures that there is no liquid residue when the Wf and liquid level separate, preventing the occurrence of watermarks. The pass line will be designed to match the cleaning line, so please feel free to contact us when you need it. 【Main Specifications】 ■ Item to be cleaned: 200mm thickness 0.75t ■ Treatment method: Dip treatment using a cassette ■ Processing speed: 5 min (variable) ■ Cleanliness inside the device: 0.1μm Class 1 ■ Pass line: Designed to match the cleaning line *For more details, please refer to the PDF document or feel free to contact us.

• Drying Equipment

The "Magnetic Head Cleaning Device" is a product designed for the final cleaning of magnetic heads, using a pallet with 12 trays arranged radially. It employs an alkaline hot water solution (10%) and applies ultrasonic waves from three directions for inclined intermittent rotational cleaning. The rinsing and drying process incorporates a composite rinsing and drying treatment that includes pure water dipping, QDR, pure water shower, and spin dryer all in one tank. The final drying is conducted using a hot plate inside the box, consisting of 1 loading station, 2 ultrasonic cleaning tanks, 3 rinsing tanks, 1 heating drying tank, and 1 unloading station. 【Specifications】 - The standard pallet size is 50mm x 50mm, with 7 other interchangeable sizes available. - The head size is 1mm square with a thickness of 0.3mm, accommodating 500 pieces within the pallet. *For more details, please refer to the PDF document or feel free to contact us.*

• Other cleaning machines

We would like to introduce our "Automated Transport Cassette Clean Oven." It is designed to handle a set of 6 cassettes, each containing 25 pieces of 8" wafers, using one clean oven along with loaders and unloaders equipped with transport robots. It is capable of processing one set at a time. The transport method can be either automatic or manual, and the maximum temperature inside the clean oven is 140°C. The external dimensions are 2590 (W) × 1400 (D) × 2400 (H). 【Main Specifications】 ■ Processed Wafers: 8” quartz wafers in cassettes × 6 ■ Transport Method: Automatic / Manual ■ Clean Oven Internal Temperature: MAX 140°C ■ Clean Oven Cleanliness: Class 10 at 0.3μm RT ■ External Dimensions: 2590 (W) × 1400 (D) × 2400 (H) *For more details, please refer to the PDF document or feel free to contact us.

• Other conveying machines

We would like to introduce our "Vacuum Drying Device." This device features a vacuum chamber made of SUS304 with a diameter of φ600 and a depth of D585, equipped with three special sheath heaters to heat the interior of the chamber. It performs vacuum drying in an oil-free state. The front door of the vacuum chamber opens to one side, providing a wide opening for easy loading and unloading of parts. Additionally, the work placement table inside the drying furnace is custom-designed to meet customer specifications. 【Main Specifications】 ■ Drying Material: General Parts ■ Chamber Size: φ600×D585 ■ Chamber Capacity: Approximately 142L ■ External Dimensions: 850W×1049D×1800H *For more details, please refer to the PDF document or feel free to contact us.

• Drying Equipment
• Vacuum Equipment

We would like to introduce our "Precision Parts Cleaning Equipment." This device is designed for degreasing and cleaning motor parts for HHD (such as hubs and cases), and consists of the following steps: detergent + ultrasonic cleaning (degreasing) → pure water rinse + ultrasonic cleaning → hot air drying → vacuum drying. We will manufacture it according to your specific needs. Please feel free to contact us when you need assistance. 【Main Specifications】 ■ Items to be cleaned: Motor parts for HHD (such as hubs and cases) ■ Cleaning method: Dip processing using a dedicated basket ■ Processing speed: 2.5 minutes (2kg × 4 baskets) ■ Pass line: FL +750 ±10mm ■ Conveying method: Tact feeding *For more details, please refer to the PDF document or feel free to contact us.

• Other cleaning machines

The "Chemical Supply Device" is an automatic mixing and supply device for HF. The supply of each chemical to the device can be done directly from the manufacturer's concentrated solution tanks or from CCSS. The supplied chemical solution is transferred to a weighing tank via a pump, where it is automatically mixed with pure water in a specified ratio. Additionally, the mixed HF is stored in a supply tank and is automatically supplied to the use point upon receiving a supply request signal. 【Main Specifications】 ■ Main Frame: Lightweight steel welded assembly, integrated structure with baked paint finish ■ Exterior Color: Ivory White ■ Exterior Coating: PVC ■ Structure: Main body draft structure, front, back, and PVC transparent panels ■ Supplied Chemical: HF (with clean air supply function for storage area) ■ Control Unit: Built-in control panel for the device ■ Supply Tank Main Frame ・SUS welded assembly, two-part structure + corrosion-resistant resin coating in ivory white *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

We would like to introduce our "Organic Solvent Cleaning Device." This is an automatic etching cleaning device for 6" wafer cassettes, controlled by a PLC. It consists of the main unit, pump unit, and control panel. The cleaning process is batch cleaning, with a flow direction of left to right using three robotic transports. Please feel free to contact us if you have any inquiries. 【Main Specifications】 ■ Transport: 2 cassette transport for 6" wafers ■ Cleaning Process: Batch cleaning ■ Flow Direction: Left to right with three robotic transports ■ Control Method: PLC ■ Chemical Supply Method: CCSS method *For more details, please refer to the PDF document or feel free to contact us.

• Other cleaning machines

The "kolleii GDK-500" is a mist shower unit designed for antiviral, antibacterial, and deodorizing purposes. It is equipped with six ultrasonic humidification units, capable of atomizing at a particle size of 3μm to 4μm, with a flow rate of 3.4L per hour. When someone stops in front of the device, the mist shower is automatically sprayed. When the supply tank is low, the empty tank warning light will illuminate. In addition to the recommended spraying solution, it can also be used with various disinfecting and antibacterial liquids. 【Features】 ■ Antiviral, antibacterial, and deodorizing ■ Equipped with ultrasonic humidification units ■ Automatic spraying with a human sensor ■ Alert function to notify of supply shortages ■ Keeps various scenes clean and safe *For more details, please refer to the PDF document or feel free to contact us.

• Other safety and hygiene products

The "kolleii GDK-500" is a mist disinfection device that can suppress the proliferation and spread of viruses and fungi by spraying a diluted solution of catechins onto clothing and other surfaces. Catechins are harmless food additives extracted from tea leaves. In addition to the recommended spray solution, this device can also be used with other disinfectant and antibacterial liquids. Our company is conducting an "Infection Control Support Campaign," offering a free rental for the first month for the first 10 units. Extensions and cancellations are possible on a monthly basis, so please take advantage of this opportunity. 【Campaign Overview】 ■ Target Product: Mist Disinfection Device "kolleii GDK-500" ■ Campaign Details - Monthly rental fee: 33,000 yen (tax included) ⇒ First month: 0 yen - Limited to the first 10 units - Requires a 100V outlet for installation - All shipping, pickup, installation, and return fees are covered by our company *For more details, please refer to the PDF document or feel free to contact us.

• Other safety and hygiene products

Our company provides products centered around clean technology, focusing on cleaning technology, purification technology, and measurement technology. We handle a variety of manufacturing equipment, including those for semiconductors, FPD, drying furnaces, vacuum systems, precision cleaning, and other devices. We offer a wide range of products, including 5, 6, and 8-inch wafer cassette cleaning systems, CF processing equipment, vacuum drying systems, R to R thermal processing continuous drying furnaces, precision parts cleaning systems, and air showers. Additionally, we have newly added airborne transport cleaning systems and non-contact transport cleaning systems. 【Various Manufacturing Equipment】 ■ Semiconductors ■ FPD ■ Drying Furnaces ■ Vacuum ■ Precision Cleaning ■ Other Devices *For more details, please refer to the PDF materials or feel free to contact us.

• Other cleaning machines
• Drying Equipment

The DNCC-320 is a cleaning device that performs cleaning, rinsing, and drying processes while floating and moving a glass substrate with a fluid. It uses pure water and other cleaning media to float and clean the substrate, controlling the drive only on the vertical edges, and it is also possible to change the size in the direction of the width. Unlike conventional roller transport systems, it does not leave scratches on the glass surface due to slipping, and the cleaning solution uniformly contacts the entire glass surface without the unevenness seen in spray cleaning. **Features** - Zero roller marks on the glass substrate - Simultaneous cleaning and drying of the front and back surfaces - Suitable for transporting thin and lightweight substrates (0.5t or less) - Functional water + ultrasonic cleaning *For more details, please refer to the PDF document or feel free to contact us.*

• Other cleaning machines
• Ultrasonic Cleaner

The "DPC-700" is a device that cleans and rinses workpieces using high-pressure pulse jet spraying, and drains water through air blowing (liquid removal from piping). As an option, it can continuously perform hot water cleaning, rinsing, and water draining within the same tank. (The temperature range will be determined during discussions.) By using dedicated fixtures, it can also clean containers and lids of various sizes. It can remove dirt from sharp grooves of plastic containers and clean the backside of two-stage structures with curved surfaces and angles made of aluminum alloy using pulse jets. 【Features】 ■ High-pressure pulse jets provide cleaning without attenuation of high water pressure ■ Cleaning of workpieces with uneven surfaces and sealing hole processing ■ Eco-friendly cleaning with minimal water usage ■ High-speed cleaning at speeds of 35 to 45 m/s ■ Adoption of a 6-axis articulated robot for cleaning that closely resembles human movement *For more details, please refer to the PDF materials or feel free to contact us.

• Other cleaning machines
• High pressure cleaner

The "DBC-1700" is a device that cleans and rinses containers using pure water injection, followed by air blowing (liquid drainage from the piping) and high-speed rotation for water removal. It continuously processes warm water cleaning, rinsing, and water removal within the same tank. By using dedicated fixtures, it can also clean containers and lids of different sizes. The cleaning shower uses warm water controlled at 40°C and cleans with a water pressure of 0.25 MPa or higher. The cleaning solution is circulated in the tank to minimize unnecessary consumption of pure water. 【Features】 ■ Capable of cleaning a variety of products ■ Cleaning power ■ Safety measures ■ Recipe operation *For more details, please refer to the PDF materials or feel free to contact us.

• Other cleaning machines
• Cleaning agents

The "DACC-061-3L" is a device designed to clean and remove various types of dirt from double-sided oval glass with patterns, ranging from 4 inches (61mm x 124mm) to 7 inches (140mm x 200mm). It is equipped with a system that generates functional water with zero content of environmental pollutants such as surfactants and chemical substances found in common detergents and cleaners, as well as BOD/COD. Despite containing 99.9% pure water, it exhibits cleaning effects equivalent to or greater than those of synthetic detergents. 【Features】 ■ Zero roller marks on glass substrates ■ Capable of multi-variety production ■ Excellent cleaning power ■ Functional water + ultrasonic cleaning *For more details, please download the PDF or feel free to contact us.

• Other cleaning machines

The "Chemical Liquid Scrub Spin Cleaning Device" is a cleaning machine that allows for various combinations of non-contact cleaning methods such as high-pressure spray, ultrasonic spray, and chemical liquids, as well as contact cleaning methods like brushes. It completes the cleaning process to spin drying within a single chamber, contributing to space-saving design that reduces installation space and costs. We can propose suitable device configurations based on various equipment configurations, chemical compositions, desired cleaning performance, and budget according to your needs. 【Features】 ■ Various cleaning methods and chemical liquids can be combined ■ Suitable for research and development applications and small to medium-sized sites ■ Ideal for sites developing and producing new materials such as SiC, GaN, and LT for small-diameter wafers and power semiconductors ■ Compatible wafer sizes: 3 inches to 6 inches (8 to 12 inches can also be accommodated upon separate consultation) *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Other semiconductor manufacturing equipment

The "Single Chamber Liquid Spin Scrub Cleaning Machine" is a cleaning device that allows for various combinations of non-contact cleaning methods such as high-pressure spray, ultrasonic spray, and chemical solutions, as well as contact cleaning methods like brushes. It completes the cleaning process to spin drying within a single chamber, contributing to space-saving design, which reduces installation space and costs. We can propose suitable equipment configurations based on various device configurations, chemical compositions, desired cleaning performance, and budget according to your needs. 【Features】 ■ Various cleaning methods and chemicals can be combined ■ Suitable for research and development applications and small to medium-sized sites ■ Ideal for sites developing and producing new materials such as SiC, GaN, and LT for small-diameter wafers and power semiconductors ■ Compatible wafer sizes: 3 inches to 6 inches (8 to 12 inches can also be accommodated upon separate consultation) *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Other semiconductor manufacturing equipment

■Device Overview A flat surface polishing device (edge polisher) that performs mirror polishing, rough polishing, and cleaning using filtered water and pure water as the medium, without using slurry or long polishing belts. The elimination of slurry and long polishing belts achieves low maintenance, space-saving, and a simple mechanism. ■Examples of Applications Mirror finishing processing, mirror finishing processing, end face foreign matter cleaning. ■Target Objects - Suitable for thin materials of 150 to 200 μm - Various wafers: compounds, oxides, glass, quartz, silicon, ceramics Please consider adopting the device after evaluation and confirmation with the actual machine. Compatible with Orifura (V-notches are not supported). Custom design and manufacturing are available through automation and specification discussions.

• Other semiconductor manufacturing equipment

This device is for degreasing and cleaning HDD motor components (HUB, case, etc.). Configuration: Detergent + Ultrasonic (degreasing) → Pure water rinse + Ultrasonic → Hot air drying → Vacuum drying. It will be manufactured according to the application.

• Other semiconductor manufacturing equipment
• Other cleaning machines

This device is designed for the cleaning of Si nuggets. The container containing the work (Si nuggets) is transferred to a dedicated cleaning basket within this device and is automatically transported to the cleaning facility. After that, the basket undergoes chemical polishing, acid etching, and high-quality water washing to clean the work. During this process, the cleaning basket is agitated to improve cleaning efficiency. After cleaning, it is moved to a dedicated drying basket and pre-dried with hot air at 150°C.

• Other semiconductor manufacturing equipment
• Other cleaning machines