Achieved 65nμm / 5 pieces of high purity! Inserted 25 pieces into the gaps of 25 Wf, halving the pitch and processing 50 pieces at once.
The "300mm Cassette-less Wafer Cleaning System" is a product used in the chemical polishing process after final polishing. It accommodates 25 wafers in the gaps of 25 wafers, arranged in a half-pitch, allowing for the simultaneous processing of 50 wafers, achieving a high cleanliness level of 65nμm/5 pieces. 【Main Specifications】 ■ Items to be cleaned: 300mm thickness 0.75t ■ Processing method: Cassette-less dip processing ■ Processing speed: 50 pieces/5 min (variable) ■ Cleanliness inside the device: 0.1μm Class 1 ■ Pass line: FL+900±5mm manual set by hoop ■ Transport method: Front transport *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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【Purpose】 ■Chemical polishing process after final polishing *For more details, please refer to the PDF document or feel free to contact us.*
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This brand name was chosen to signify the creation of highly unique products with the aim of "EXTENSIVE VISION ON SYSTEM." Current technological innovations are remarkable, and the demands of the times are constantly becoming more advanced. We believe that it is our mission at Zebios to contribute to the industry by consistently proposing differentiated equipment that will revolutionize the now-mature equipment industry.
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