株式会社ダン科学 Product Lineup

A single-wafer device that performs the processes of surfactant and pure water scrub cleaning, chemical spraying, megasonic spot shower, and spin drying all in one chamber. ◇ Space-saving design that completes the process in a single chamber ◇ Compatible with various wafers including Si (silicon), LT (lithium tantalate), and SiC (silicon carbide) ◇ Removal of foreign substances (organic and inorganic) and metal ions ◇ Flexible response to changes in cleaning items and device configuration *For more details, please contact us or download the catalog to view.

This is a single-chamber device that performs various sizes and types of wafers, including surfactants, pure water scrubbing, chemical spraying, megasonic spot showering, and spin drying. It is a space-saving model that allows for complete cleaning within a single cleaning layer, making it suitable for locations with limited space. Please consult us regarding single-function scrub cleaning devices. 【Features】 ■ Cleaning, rinsing, and drying can be done in one place ■ Target wafers: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ4”, φ6” to φ8” *For more details, please contact us or download the catalog for more information.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download and view the catalog.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.

A single-wafer device that performs polishing slurry cleaning with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing is also performed. ■ Capable of simultaneous cleaning of both sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for review.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing is also performed. ■ Capable of simultaneous cleaning of both sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog to view.

This is a single-wafer cleaning device that removes polishing slurry after polishing using disk scrub cleaning, and can perform chemical spraying, megasonic spot showering, and spin drying. It is capable of removing stubborn contaminants and metal contamination through chemical spraying, and can also accommodate simultaneous scrub cleaning of the edges as an option. ■ Simultaneous cleaning of both sides ■ Target wafers: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ4”, thickness is negotiable ■ Compatible with transparent wafers *For more details, please contact us or download the catalog for more information.

This is a cleaning device that performs cleaning of various carriers (cassettes) using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling processes from cleaning to drying. *For more details, please contact us or download the catalog to view.

This is a cleaning device that performs the cleaning of various boxes using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling both the cleaning and drying processes. *For more details, please contact us or download the catalog to view it.*

This is a cleaning device that performs cleaning of various FOSBs using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling the cleaning to drying process. *For more details, please contact us or download and view the catalog.*

This is a cleaning device that performs cleaning of various boxes using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling the cleaning to drying process. 【Features】 ■ Cleaning tailored to complex shapes such as hoops ■ Automation of the cleaning process, ensuring stable cleaning effectiveness *For more details, please contact us or download the catalog to view.

This device is designed for the cleaning of Si nuggets. The container containing the work (Si nuggets) is transferred to a dedicated cleaning basket within this device and is automatically transported to the cleaning facility. After that, the basket undergoes chemical polishing, acid etching, and high-quality water washing to clean the work. During this process, the cleaning basket is agitated to improve cleaning efficiency. After cleaning, it is moved to a dedicated drying basket and pre-dried with hot air at 150°C.

This device is for degreasing and cleaning HDD motor components (HUB, case, etc.). Configuration: Detergent + Ultrasonic (degreasing) → Pure water rinse + Ultrasonic → Hot air drying → Vacuum drying. It will be manufactured according to the application.

The "DACC-061-3L" is a device designed to clean and remove various types of dirt from double-sided oval glass with patterns, ranging from 4 inches (61mm x 124mm) to 7 inches (140mm x 200mm). It is equipped with a system that generates functional water with zero content of environmental pollutants such as surfactants and chemical substances found in common detergents and cleaners, as well as BOD/COD. Despite containing 99.9% pure water, it exhibits cleaning effects equivalent to or greater than those of synthetic detergents. 【Features】 ■ Zero roller marks on glass substrates ■ Capable of multi-variety production ■ Excellent cleaning power ■ Functional water + ultrasonic cleaning *For more details, please download the PDF or feel free to contact us.

The "DBC-1700" is a device that cleans and rinses containers using pure water injection, followed by air blowing (liquid drainage from the piping) and high-speed rotation for water removal. It continuously processes warm water cleaning, rinsing, and water removal within the same tank. By using dedicated fixtures, it can also clean containers and lids of different sizes. The cleaning shower uses warm water controlled at 40°C and cleans with a water pressure of 0.25 MPa or higher. The cleaning solution is circulated in the tank to minimize unnecessary consumption of pure water. 【Features】 ■ Capable of cleaning a variety of products ■ Cleaning power ■ Safety measures ■ Recipe operation *For more details, please refer to the PDF materials or feel free to contact us.

Our company provides products centered around clean technology, focusing on cleaning technology, purification technology, and measurement technology. We handle a variety of manufacturing equipment, including those for semiconductors, FPD, drying furnaces, vacuum systems, precision cleaning, and other devices. We offer a wide range of products, including 5, 6, and 8-inch wafer cassette cleaning systems, CF processing equipment, vacuum drying systems, R to R thermal processing continuous drying furnaces, precision parts cleaning systems, and air showers. Additionally, we have newly added airborne transport cleaning systems and non-contact transport cleaning systems. 【Various Manufacturing Equipment】 ■ Semiconductors ■ FPD ■ Drying Furnaces ■ Vacuum ■ Precision Cleaning ■ Other Devices *For more details, please refer to the PDF materials or feel free to contact us.

The DNCC-320 is a cleaning device that performs cleaning, rinsing, and drying processes while floating and moving a glass substrate with a fluid. It uses pure water and other cleaning media to float and clean the substrate, controlling the drive only on the vertical edges, and it is also possible to change the size in the direction of the width. Unlike conventional roller transport systems, it does not leave scratches on the glass surface due to slipping, and the cleaning solution uniformly contacts the entire glass surface without the unevenness seen in spray cleaning. **Features** - Zero roller marks on the glass substrate - Simultaneous cleaning and drying of the front and back surfaces - Suitable for transporting thin and lightweight substrates (0.5t or less) - Functional water + ultrasonic cleaning *For more details, please refer to the PDF document or feel free to contact us.*

The "DPC-700" is a device that cleans and rinses workpieces using high-pressure pulse jet spraying, and drains water through air blowing (liquid removal from piping). As an option, it can continuously perform hot water cleaning, rinsing, and water draining within the same tank. (The temperature range will be determined during discussions.) By using dedicated fixtures, it can also clean containers and lids of various sizes. It can remove dirt from sharp grooves of plastic containers and clean the backside of two-stage structures with curved surfaces and angles made of aluminum alloy using pulse jets. 【Features】 ■ High-pressure pulse jets provide cleaning without attenuation of high water pressure ■ Cleaning of workpieces with uneven surfaces and sealing hole processing ■ Eco-friendly cleaning with minimal water usage ■ High-speed cleaning at speeds of 35 to 45 m/s ■ Adoption of a 6-axis articulated robot for cleaning that closely resembles human movement *For more details, please refer to the PDF materials or feel free to contact us.

We would like to introduce our "Organic Solvent Cleaning Device." This is an automatic etching cleaning device for 6" wafer cassettes, controlled by a PLC. It consists of the main unit, pump unit, and control panel. The cleaning process is batch cleaning, with a flow direction of left to right using three robotic transports. Please feel free to contact us if you have any inquiries. 【Main Specifications】 ■ Transport: 2 cassette transport for 6" wafers ■ Cleaning Process: Batch cleaning ■ Flow Direction: Left to right with three robotic transports ■ Control Method: PLC ■ Chemical Supply Method: CCSS method *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce our "Precision Parts Cleaning Equipment." This device is designed for degreasing and cleaning motor parts for HHD (such as hubs and cases), and consists of the following steps: detergent + ultrasonic cleaning (degreasing) → pure water rinse + ultrasonic cleaning → hot air drying → vacuum drying. We will manufacture it according to your specific needs. Please feel free to contact us when you need assistance. 【Main Specifications】 ■ Items to be cleaned: Motor parts for HHD (such as hubs and cases) ■ Cleaning method: Dip processing using a dedicated basket ■ Processing speed: 2.5 minutes (2kg × 4 baskets) ■ Pass line: FL +750 ±10mm ■ Conveying method: Tact feeding *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce our "Vacuum Drying Device." This device features a vacuum chamber made of SUS304 with a diameter of φ600 and a depth of D585, equipped with three special sheath heaters to heat the interior of the chamber. It performs vacuum drying in an oil-free state. The front door of the vacuum chamber opens to one side, providing a wide opening for easy loading and unloading of parts. Additionally, the work placement table inside the drying furnace is custom-designed to meet customer specifications. 【Main Specifications】 ■ Drying Material: General Parts ■ Chamber Size: φ600×D585 ■ Chamber Capacity: Approximately 142L ■ External Dimensions: 850W×1049D×1800H *For more details, please refer to the PDF document or feel free to contact us.

The "Magnetic Head Cleaning Device" is a product designed for the final cleaning of magnetic heads, using a pallet with 12 trays arranged radially. It employs an alkaline hot water solution (10%) and applies ultrasonic waves from three directions for inclined intermittent rotational cleaning. The rinsing and drying process incorporates a composite rinsing and drying treatment that includes pure water dipping, QDR, pure water shower, and spin dryer all in one tank. The final drying is conducted using a hot plate inside the box, consisting of 1 loading station, 2 ultrasonic cleaning tanks, 3 rinsing tanks, 1 heating drying tank, and 1 unloading station. 【Specifications】 - The standard pallet size is 50mm x 50mm, with 7 other interchangeable sizes available. - The head size is 1mm square with a thickness of 0.3mm, accommodating 500 pieces within the pallet. *For more details, please refer to the PDF document or feel free to contact us.*

We would like to introduce the "Yutaka Drying Device" that we handle. The device dries 25 sheets of Wf in a cassette using the principle of surface tension and slow lifting. By controlling the lifter and liquid level, it ensures that there is no liquid residue when the Wf and liquid level separate, preventing the occurrence of watermarks. The pass line will be designed to match the cleaning line, so please feel free to contact us when you need it. 【Main Specifications】 ■ Item to be cleaned: 200mm thickness 0.75t ■ Treatment method: Dip treatment using a cassette ■ Processing speed: 5 min (variable) ■ Cleanliness inside the device: 0.1μm Class 1 ■ Pass line: Designed to match the cleaning line *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce our "Mask Glass Cleaning Device." The mask glass is stored in an original cassette and cleaned using SPM and a neutral detergent + US, followed by drying with warm water. The process is carried out in the following order: LD → Underwater → SPM → Rinse → Rinse → Neutral Detergent + US → Rinse + US → Rinse → SC-1 → Rinse → Rinse + MUS → Rinse → Warm Water Lift → ULD. 【Main Specifications】 ■ Conveying Direction: Left → Right ■ Passline: 400mm (LD, ULD) ■ Substrate Mask: min 9”×9” to max 24”×24” ■ Main Body Dimensions (Material) ・PVC Wrapped (Ivory): 8000W×2350D×2600H (2900H) ・Frame: Made of SUS304 *For more details, please refer to the PDF document or feel free to contact us.

This product is a device designed for cleaning Si nuggets. Containers with the workpieces (Si nuggets) are transferred to a dedicated cleaning basket and automatically transported within the cleaning equipment. After that, the basket undergoes chemical polishing, acid etching, and high-quality water rinsing, during which the workpieces are cleaned. At this time, the cleaning basket is agitated to improve cleaning efficiency. After cleaning, the workpieces are transferred to a dedicated drying basket and pre-dried with hot air at 150°C. 【Main Specifications】 ■ Items to be cleaned: Si nuggets ■ Treatment method: Water rinse ⇒ Chemical cleaning ⇒ Rinse ⇒ Pre-drying ■ Transport method: Automatic transport by a transport robot ■ Chemicals used: Hydrofluoric acid, Nitric acid *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce our "Cassette Cleaning Device for PDP." This automatic cleaning device transports PDP substrates using a cassette, which is subjected to a hot water high-pressure shower, liquid drainage, and hot air drying. It is designed and manufactured to fit the specific cassette. The cleaning method involves pure water high-pressure washing combined with hot air drying. 【Main Specifications】 ■ Heated Object: PDP Cassette (2800W × 4700D × 1500H) Weight: 1000kg ■ Cleaning Method: Pure water high-pressure washing + hot air drying ■ Processing Speed: 100mm/s (Tact Time: 28min) ■ Heating Conditions: 100℃ ±5℃ ■ Pass Line: FL + 2400 *For more details, please refer to the PDF document or feel free to contact us.

This is an introduction to the "processing equipment for OLED" that our company handles. We provide cleaning equipment for organic EL manufacturing lines. The substrate size we process is 370×470×1.1. The equipment consists of incoming cleaning, pure water cleaning, developing equipment, stripping equipment, Cr etching equipment, and ITO etching equipment. 【Main Specifications】 ■ Items to be cleaned: Glass substrate 370×470 thickness 0.6–1.1t ■ Processing method: Single sheet processing ■ Processing speed: 0.6–5.0m/min (variable) ■ Pass line: FL + 1100mm *For more details, please refer to the PDF document or feel free to contact us.

The "IR Drying Oven" is a product that processes items using tact transport via roller conveyance. By heating the substrates after cleaning and air blowing, it evaporates the moisture on the substrates and implements drying. Glass substrates are heated and dried using a clean far-infrared heater (Class 100). 【Main Specifications】 ■ Heated Item: TFT Glass Panel (2880×3130×0.6t) ■ Processing Method: Tact transport via roller conveyance (6° incline) ■ Processing Speed: 75mm/s (Tact Time: 56sec) ■ Heating Conditions: Glass surface temperature reaches 70 ℃ or higher ■ Pass Line: FL+1800±25mm *For more details, please refer to the PDF document or feel free to contact us.

The "300mm Cassette-less Wafer Cleaning System" is a product used in the chemical polishing process after final polishing. It accommodates 25 wafers in the gaps of 25 wafers, arranged in a half-pitch, allowing for the simultaneous processing of 50 wafers, achieving a high cleanliness level of 65nμm/5 pieces. 【Main Specifications】 ■ Items to be cleaned: 300mm thickness 0.75t ■ Processing method: Cassette-less dip processing ■ Processing speed: 50 pieces/5 min (variable) ■ Cleanliness inside the device: 0.1μm Class 1 ■ Pass line: FL+900±5mm manual set by hoop ■ Transport method: Front transport *For more details, please refer to the PDF document or feel free to contact us.

This is a single-wafer cleaning device that removes polishing slurry after polishing using disk scrub cleaning, followed by chemical spray, megasonic spot shower, and spin drying. It is capable of removing stubborn residues and metal contamination through chemical spraying, and can also accommodate simultaneous scrub cleaning of the edge as an option. ■ Simultaneous cleaning of both sides and edges is possible ■ Target wafers: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ4” (thickness negotiable) ■ Supports transparent wafers as well *For more details, please contact us or download and view the catalog.

This is a cleaning device that performs cleaning of various carriers (cassettes) using high-pressure pulse jets while maintaining a constant distance from the object being cleaned with a multi-joint robot. It is capable of handling processes from cleaning to drying. *For more details, please contact us or download the catalog to view it.*

This is a cleaning device that performs cleaning of various boxes using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling both the cleaning and drying processes. *For more details, please contact us or download the catalog to view it.*

This is a cleaning device that performs cleaning of various FOSBs using a high-pressure pulse jet while maintaining a constant distance from the object being cleaned with a multi-joint robot. It is capable of handling the cleaning to drying process. *For more details, please contact us or download and view the catalog.*

This is a cleaning device that performs the cleaning of various boxes using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling the cleaning to drying process. 【Features】 ■ Cleaning adapted to complex shapes such as hoops ■ Automation of the cleaning process ensures stable cleaning effects *For more details, please contact us or download the catalog to view.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It enables transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing cleaning is also performed. ■ Simultaneous cleaning of both sides is possible ■ Wafer types to be cleaned: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Supports transparent wafers as well *For more details, please contact us or download the catalog for more information.

A single-wafer device that performs the processes of surfactant and pure water scrub cleaning, chemical spraying, megasonic spot shower, and spin drying all in one chamber. ◇ Space-saving design that completes all processes in a single chamber ◇ Compatible with various wafers including Si (silicon), LT (lithium tantalate), and SiC (silicon carbide) ◇ Removal of foreign substances (organic and inorganic) and metal ions ◇ Flexible adaptation to changes in cleaning items and equipment configuration *For more details, please contact us or download the catalog to view.

This is a single-chamber device that performs various sizes and types of wafer cleaning, including surfactants, pure water scrubbing, chemical spraying, megasonic spot showering, and spin drying. It is a space-saving model that allows for complete cleaning within a single cleaning layer, making it suitable for areas with limited space. Please consult us regarding single-function scrub cleaning devices. 【Features】 ■ Cleaning, rinsing, and drying can be done in one location ■ Wafer types to be cleaned: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ4”, φ6” to φ8” *For more details, please contact us or download the catalog for further information.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing is also performed. ■ Capable of simultaneous cleaning of both sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8” (thickness to be discussed) ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Simultaneous cleaning of both sides is possible ■ Wafer types for cleaning: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8” (thickness to be discussed) ■ Supports transparent wafers as well *For more details, please contact us or download and view the catalog.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It enables transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.