LT・SiC and other 2 to 6-inch small diameter wafer simultaneous chemical scrub cleaning device.

A chemical cleaning device that enables transportation and drying without touching the front and back of the workpiece, as well as the removal of foreign substances and metal contamination! It also supports a combination with brush cleaning using the chemical solution.

This is a single-wafer cleaning device that removes polishing slurry after polishing using disk scrub cleaning, followed by chemical spray, megasonic spot shower, and spin drying. It is capable of removing stubborn residues and metal contamination through chemical spraying, and can also accommodate simultaneous scrub cleaning of the edge as an option. ■ Simultaneous cleaning of both sides and edges is possible ■ Target wafers: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ4” (thickness negotiable) ■ Supports transparent wafers as well *For more details, please contact us or download and view the catalog.

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