株式会社ダン科学 Product Lineup

<Equipment Overview> This device is used in the chemical polishing process after final polishing. Its feature is that it places 25 wafers in the gaps of 25 wafers, creating a half pitch, allowing for the simultaneous processing of 50 wafers. It achieves a high purity of 19nμm / 5 pieces.

• Other semiconductor manufacturing equipment
• Other cleaning machines

This is a cleaning device that performs cleaning of various boxes using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling the cleaning to drying process. 【Features】 ■ Cleaning tailored to complex shapes such as hoops ■ Automation of the cleaning process, ensuring stable cleaning effectiveness *For more details, please contact us or download the catalog to view.

• Other semiconductor manufacturing equipment

This is a cleaning device that performs cleaning of various FOSBs using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling the cleaning to drying process. *For more details, please contact us or download and view the catalog.*

• Other semiconductor manufacturing equipment

This is a cleaning device that performs the cleaning of various boxes using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling both the cleaning and drying processes. *For more details, please contact us or download the catalog to view it.*

• Other semiconductor manufacturing equipment

This is a cleaning device that performs cleaning of various carriers (cassettes) using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling processes from cleaning to drying. *For more details, please contact us or download the catalog to view.

• Other semiconductor manufacturing equipment

A cleaning nozzle unit that requires less water and is less likely to create a water film, which can also be retrofitted to existing equipment. A cleaning nozzle that operates at a maximum of 30Hz. A pump that generates high-pressure water of 5 to 10 MPa. A combination with a control unit. Conventional continuous spraying applies pressure over a self-created water film, leading to an increase in cleaning power = increase in pressure = increase in flow rate, resulting in a thicker water film. However, the DP-Gun uses intermittent spraying, which means that even at the same pressure (impact), the flow rate is lower, making it less likely to form a water film, and the sprayed water directly impacts the target object. By repeatedly applying intermittent spray impacts, it demonstrates excellent cleaning effects in removing foreign substances from the items being cleaned, cleaning masks, and cleaning three-dimensional objects such as cassettes (with narrow grooves and complex shapes). The pump unit achieves stable water pressure control with minimal waste water during pressure adjustment by performing feedback control that matches flow rate changes due to nozzle opening and closing. *Please consult us regarding spraying a fixed amount of liquid and measurement + spray application. *Nozzles and pumps require regular maintenance.

• Other cleaning machines

A cleaning nozzle unit that requires less water and is less likely to form a water film, which can be retrofitted to existing equipment. A cleaning nozzle that operates at a maximum of 30Hz. A pump that generates high-pressure water of 5 to 10 MPa. A combination of control units. Conventional continuous spraying applies pressure over a self-created water film, which tends to increase cleaning power = increase pressure = increase flow rate, resulting in a thicker water film. However, the DP-Gun uses intermittent spraying, which results in a lower flow rate at the same pressure (impact), making it less likely to form a water film and allowing the sprayed water to directly impact the target object. By repeatedly applying intermittent spray impacts, it demonstrates excellent cleaning effects for removing foreign substances from the items being cleaned, cleaning masks, and cleaning three-dimensional objects such as cassettes (with narrow grooves and intricate shapes). The pump unit achieves stable water pressure control with minimal water waste during pressure adjustments by performing feedback control in accordance with flow rate changes caused by the opening and closing of the nozzle. *Please consult us regarding the spraying of a fixed amount of liquid and spray application measurement. *Regular maintenance of the nozzle and pump is required.

• Other cleaning machines

This is a dispersion and scattering device for particles that has developed a dry scattering technology for the spacer scattering process in liquid crystal displays, capable of handling nanoparticles as well. It controls the amount of scattering based on feedback control derived from the amount of charge during scattering. A fixed multiplexer nozzle is used, allowing for uniform particle scattering in all directions by simply switching the air without moving the nozzle. Additionally, by applying high voltage to the wall surfaces, it suppresses particle adhesion to the walls, improving particle utilization efficiency and ensuring uniform dispersion performance even for larger workpieces. This tabletop scattering machine is designed for research and development and prototyping, accommodating workpiece sizes of approximately 100mm×100mm to 300mm×300mm. (It is also possible to manufacture mass production equipment for large glass sizes such as 1500mm×1500mm and for inline applications.) *For more details, please contact us.

• LCD display

This is a dispersion and scattering device for particles that has developed a dry scattering technology for the spacer scattering process in liquid crystal displays, capable of handling nanoparticles as well. It controls the amount of scattering based on feedback control derived from the amount of charge during scattering. The device uses a fixed multiplexer nozzle, allowing for uniform particle dispersion in all directions by simply switching the air without moving the nozzle. Additionally, by applying high voltage to the wall surfaces, it suppresses particle adhesion to the walls, improving particle utilization efficiency and ensuring uniform dispersion performance even for larger workpieces. This tabletop scattering machine is suitable for workpiece sizes ranging from approximately 100mm×100mm to 300mm×300mm. (It is also possible to manufacture mass production devices for inline applications, accommodating large glass sizes such as 1500mm×1500mm.) *For more details, please contact us.*

• LCD display

This is a dispersion and scattering device for particles that has developed a dry scattering technology for the spacer application process in liquid crystal panel manufacturing, capable of handling nanoparticles as well. The control of the scattering amount is performed based on feedback control derived from the amount of charge during scattering. A fixed multiplexer nozzle is used, allowing for uniform particle scattering in all directions without moving the nozzle. Additionally, by applying high voltage to the walls, it suppresses particle adhesion to the wall surfaces, improving particle utilization efficiency and ensuring uniform dispersion performance even for larger-sized workpieces. It accommodates research and development applications of approximately 100 to 200 mm square, as well as mass production equipment such as G6 size. (We can also propose and manufacture inline devices combined with cluster cleaners, inspection equipment, etc.) It is capable of scattering large particle size spacers of 20 to 30 μm, as well as processes for dimming glass and smart glass. Please feel free to consult us regarding particle procurement and other inquiries. *For more details, please contact us.*

• LCD display

A single-wafer device that performs the processes of surfactant and pure water scrub cleaning, chemical spraying, megasonic spot shower, and spin drying all in one chamber. ◇ Space-saving design that completes the process in a single chamber ◇ Compatible with various wafers including Si (silicon), LT (lithium tantalate), and SiC (silicon carbide) ◇ Removal of foreign substances (organic and inorganic) and metal ions ◇ Flexible response to changes in cleaning items and device configuration *For more details, please contact us or download the catalog to view.

• Other semiconductor manufacturing equipment

This is a single-wafer cleaning device that removes polishing slurry after polishing using disk scrub cleaning, and can perform chemical spraying, megasonic spot showering, and spin drying. It is capable of removing stubborn contaminants and metal contamination through chemical spraying, and can also accommodate simultaneous scrub cleaning of the edges as an option. ■ Simultaneous cleaning of both sides ■ Target wafers: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ4”, thickness is negotiable ■ Compatible with transparent wafers *For more details, please contact us or download the catalog for more information.

• Other cleaning machines

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing is also performed. ■ Capable of simultaneous cleaning of both sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog to view.

• Other cleaning machines

A single-wafer device that performs polishing slurry cleaning with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing is also performed. ■ Capable of simultaneous cleaning of both sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for review.

• Other cleaning machines

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.

• Other cleaning machines

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download and view the catalog.

• Other cleaning machines

This is a single-chamber device that performs various sizes and types of wafers, including surfactants, pure water scrubbing, chemical spraying, megasonic spot showering, and spin drying. It is a space-saving model that allows for complete cleaning within a single cleaning layer, making it suitable for locations with limited space. Please consult us regarding single-function scrub cleaning devices. 【Features】 ■ Cleaning, rinsing, and drying can be done in one place ■ Target wafers: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ4”, φ6” to φ8” *For more details, please contact us or download the catalog for more information.

• Other semiconductor manufacturing equipment