Rework and reballing of BGA/CSP! We enable regeneration tailored to our customers' needs.
We would like to introduce our "Rework System." By adopting a powerful bottom heater, it is capable of handling multilayer boards with a thickness of 4mm, which have been considered difficult to repair. Reliable and high-quality repairs are achieved through temperature profile measurements using a data logger. With extensive experience in high-density mounting, we enable regeneration tailored to our customers' needs. 【Features】 ■ Supports large substrates up to: 458mm x 560mm ■ Capable of handling multilayer boards with a thickness of 4mm, which have been considered difficult to repair ■ Holds multiple dedicated nozzles tailored to devices, and custom manufacturing is possible ■ Achieves reliable and high-quality repairs through temperature profile measurements using a data logger *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Reballing Process Flow】 ■1. Baking of the substrate (components) ■2. Cleaning (solder removal) ■3. Flux application ■4. Placement of solder balls ■5. Heating (repair machine) ■6. Cleaning and visual inspection *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
MES Corporation is a contract manufacturer of various electronic devices, ranging from industrial to consumer use. We are expanding our business through manufacturing operations and general/specialized dispatch and EMS services. Additionally, we aim to assist our customers by providing high-quality services from surface mounting to finished products. Please feel free to contact us if you have any inquiries.