Proposal based on the concept of new POP implementation! It can reduce the package footprint after implementation.
POP (Package On Package) is a technology that increases integration density by stacking IC packages that were previously arranged in a two-dimensional layout on a circuit board. It is primarily used in industries that manufacture mobile devices such as mobile phones, portable music players, and car navigation systems, where high-density implementation is required. By adopting a stacked structure for the packages, it allows for the combination of packages with different functions. 【Features】 ■ Reduces the occupied area of the package after implementation ■ Enables the combination of packages with different functions by using a stacked structure ■ Minimizes wiring between packages, reducing the impact of reflections and noise, and our company also supports POP configurations with three or more layers *For more details, please refer to the PDF materials or feel free to contact us.
Inquire About This Product
basic information
【Type】 ■Implementation of probes for oscilloscopes ■Implementation of pattern conversion boards and conversion boards for measurement surveys *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Usage】 ■ Industries that manufacture mobile devices such as mobile phones, portable music players, and car navigation systems, which require high-density mounting. *For more details, please refer to the PDF document or feel free to contact us.
catalog（3）
Download All Catalogs
Company information
Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.