Solve problems with abundant experience and reliable skills! BGA jumpers possible down to 0.4mm pitch.
"BGA jumper wires" refer to modification work that is carried out to correct or repair wiring when there has been a mistake in the pattern at the BGA location mounted on the circuit board, or for purposes such as circuit changes. Kei-All is actively engaged in many high-difficulty tasks, including investigating and analyzing individual terminals of BGA and CSP, and assisting in correcting patterns by connecting wiring between terminals and from terminals to other components. [Features] ■ BGA jumper capable up to 0.4mm pitch ■ Wiring possible from underneath the BGA, allowing for pattern swapping and signal verification ■ Can be mounted on the circuit board even with wiring from the BGA *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Other Modifications】 ■ Pattern Cutting ■ Jumper and Solder Short ■ Component Removal and Installation ■ Component Replacement and Re-implementation ■ IC Pin Lifting ■ PAD Repair ■ Resist Stripping, etc. *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（3）
Download All Catalogs
Company information
Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.