High-precision equipment for substrates that fully utilizes the performance of Vela's 300Krpm and 350Krpm spindles!
This is equipment designed for high-precision substrates that fully utilizes the performance of Vela's 300Krpm and 350Krpm spindles. The Z-axis features a linear drive specification, enabling high-speed operation of the Z-axis, making it suitable for high-speed and high-precision processing of high-precision substrates.
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basic information
This is equipment designed for high-precision substrates that fully utilizes the performance of Vela's 300Krpm and 350Krpm spindles. The Z-axis features a linear drive specification, enabling high-speed operation of the Z-axis, making it suitable for high-speed and high-precision processing of high-precision substrates.
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This is equipment designed for high-precision substrates that fully utilizes the performance of Vela's 300Krpm and 350Krpm spindles. The Z-axis features a linear drive specification, enabling high-speed operation of the Z-axis, making it suitable for high-speed and high-precision processing of high-precision substrates.
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Company information
At Daifune Corporation Japan, we are developing and selling our own brand Vela products, including printed circuit board hole drilling machines and printed circuit board outline processing machines, as well as our own CO2/UV laser processing machines, and we are expanding a technology proposal-based JOBSHOP business. Furthermore, we offer various inspection devices (laser via AOI, hole AOI, fully automatic circuit AOI, X-ray inspection equipment, etc.), various spindles, parts and materials for hole drilling and outline processing machines, as well as a modification/maintenance business for used machines. We will utilize our technological capabilities to propose and realize solutions to various problems, so we look forward to your contact with us.