Introducing products related to semiconductor manufacturing, including "vacuum chucks" and "heat comas"!
We would like to introduce our "Porous Adsorption Stage." The "Vacuum Chuck" is used to hold wafers during die bonding. Additionally, to solve issues such as neighboring chip lift-off or rotation during pickup, we recommend the "Porous Chuck." Furthermore, the "Heat Coma" allows for uniform adsorption across the entire surface without the need for adsorption holes by using porous materials in the work mounting area. 【Features】 <Vacuum Chuck> ■ Holds wafers during die bonding ■ Custom orders can accommodate various materials, shapes, and patterns <Porous Chuck> ■ Capable of uniformly holding wafer sheets (chips) across the entire surface ■ Eliminates warping of wafer sheets *For more details, please refer to the related links or feel free to contact us.
Inquire About This Product
basic information
【Other Features】 <Heat Comma> ■ Uses porous material in the work mounting section ■ Uniform adsorption is possible across the entire surface even without suction holes *For more details, please refer to the related links or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the related links or feel free to contact us.
Company information
Taisho Corporation was founded in the lush green city of Kawagoe to develop semiconductors, LCDs, vacuum, and cooling devices, as well as to engage in precision product processing. As part of our corporate social responsibility, we promote activities that consider environmental conservation and contribute to the realization of a prosperous society through the creation of environmentally harmonious products.