Reduce downtime and defect rates caused by chip adhesion errors and bonding mistakes!
The "Porous Adsorption Stage" is a stage that can reduce the operational rate decline due to chip adsorption errors and the defect rate caused by bonding errors. It allows for full adsorption of wafer sheets and can also eliminate warping of the wafer sheets. Furthermore, it resolves foreign matter contamination (plating debris) caused by plating peeling during wafer adsorption. Custom orders can accommodate various materials and shapes. Please feel free to consult us. 【Features】 ■ Reduces pickup errors caused by chip floating and rotation ■ Allows for full adsorption of wafer sheets ■ Capable of eliminating warping of wafer sheets ■ Stabilizes the amount of needle lift *For more details, please refer to the catalog or feel free to contact us.
Inquire About This Product
basic information
Types of porous materials ■2μm ■5μm ■10μm ■20μm ■40μm ■70μm ■100μm ■120μm *For more details, please refer to the catalog or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the catalog or feel free to contact us.
Company information
Taisho Corporation was founded in the lush green city of Kawagoe to develop semiconductors, LCDs, vacuum, and cooling devices, as well as to engage in precision product processing. As part of our corporate social responsibility, we promote activities that consider environmental conservation and contribute to the realization of a prosperous society through the creation of environmentally harmonious products.
