Collection of Case Studies on Cross-Section Observation and Structural Analysis (e.g., FE-SEM/EBSD) 2
We will introduce various cases of micro-section machining and analysis, residual stress measurement, and more using ion milling, FE-SEM, EBSD, etc. The materials are available for download.
In this case study collection, we will introduce examples related to "cross-sectional observation and structural analysis." Starting with the analysis case of "Evaluation of aluminum sputter films using EBSD," we also include numerous examples such as the purpose, methods, samples, and results of "Cross-sectional processing of micro areas by ion milling," and the purpose, methods, and results of "Residual stress measurement of solder cross-sections." Additionally, we present orientation evaluations, cross-sectional observation results, and measurements. We encourage you to read through it. 【Contents】 ■ Evaluation of aluminum sputter films using EBSD ■ Cross-sectional processing of micro areas by ion milling ■ Residual stress measurement of solder cross-sections ■ Residual stress measurement of wire ■ Cooling (cryo) ion milling cross-sectional processing *For more details, please refer to the PDF document or feel free to contact us.
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【Details of Publication (Excerpt)】 ■Evaluation of Aluminum Sputter Films Using EBSD ・Analysis Case ■Microsection Processing by Ion Milling ・Objective: To create a cross-section near the center of the wire for observation using the ion milling method ・Method: Ion milling, FE-SEM ・Sample: Processed at the wire bonding part of an IC chip ・Results: Cross-section creation and observation possible at the center of the wire (25μm) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Seiko Future Creation Co., Ltd. conducts business centered on contract analysis services, research and development, production technology, and FA systems, providing various services aimed at solving customer challenges. Regarding contract analysis, we have a proven track record of solving issues in the development, manufacturing, and quality assurance processes within the Seiko Group, allowing us to respond comprehensively by anticipating the background in various situations. We can handle samples ranging from million-order to nano-order sizes based on our extensive analytical experience primarily in watches and ICs, as well as in printer-related fields. In particular, we tackle customer challenges "from multiple perspectives and comprehensively" using the following technologies: - Microfabrication using a focused ion beam (FIB) device - Thermal analysis of material properties using differential scanning calorimetry (DSC) and others - Observation of microstructure using scanning probe microscopy (AFM) and others - Surface analysis using various devices (XPS, AES, GD-OES) - Cross-sectional observation and structural analysis using various devices (SEM, TEM) Our engineers are available for direct consultations. If you have any concerns, please feel free to reach out to us. *Seiko Future Creation Co., Ltd. changed its name from Seiko I-Techno Research Co., Ltd. on July 1, 2022.