In addition to general thermal analysis, we will introduce many examples of our strengths in DSC, TG-DTA, DMA, etc., including low-temperature measurements and estimates of deformation and fracture.
In this case study collection, we will introduce examples related to "thermal analysis." - "DSC Measurement of Silicone Rubber (Low-Temperature Measurement)" - "Quantification of Carbon Black by Thermogravimetric Measurement" - "Estimation of Deformation and Fracture of Plastics under Compressive Stress" We also present various methods and results, as well as analysis results, measurement data, and case studies. We encourage you to take a look. [Contents] ■ DSC Measurement of Silicone Rubber (Low-Temperature Measurement) ■ Quantification of Carbon Black by Thermogravimetric Measurement ■ Estimation of Deformation and Fracture of Plastics under Compressive Stress ■ Long-Term Deformation Prediction by DMA *For more details, please refer to the PDF document or feel free to contact us.
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【Details of Publication (Excerpt)】 ■DSC Measurement of Silicone Rubber (Low Temperature Measurement) ・Sample: Measurement of the transition and melting behavior of silicone rubber ・Method: DSC ・Results: The transition of silicone rubber observed in the negative temperature range was measured. ■Quantification of Carbon Black by Thermogravimetric Measurement ・Objective: To quantify the amount of carbon black in rubber ・Method: Simultaneous Differential Thermal and Thermogravimetric Analysis (TG-DTA) ・Results: The amount of carbon black in the rubber was confirmed. *For more details, please refer to each PDF document.
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For more details, please refer to the PDF document or feel free to contact us.
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Seiko Future Creation Co., Ltd. conducts business centered on contract analysis services, research and development, production technology, and FA systems, providing various services aimed at solving customer challenges. Regarding contract analysis, we have a proven track record of solving issues in the development, manufacturing, and quality assurance processes within the Seiko Group, allowing us to respond comprehensively by anticipating the background in various situations. We can handle samples ranging from million-order to nano-order sizes based on our extensive analytical experience primarily in watches and ICs, as well as in printer-related fields. In particular, we tackle customer challenges "from multiple perspectives and comprehensively" using the following technologies: - Microfabrication using a focused ion beam (FIB) device - Thermal analysis of material properties using differential scanning calorimetry (DSC) and others - Observation of microstructure using scanning probe microscopy (AFM) and others - Surface analysis using various devices (XPS, AES, GD-OES) - Cross-sectional observation and structural analysis using various devices (SEM, TEM) Our engineers are available for direct consultations. If you have any concerns, please feel free to reach out to us. *Seiko Future Creation Co., Ltd. changed its name from Seiko I-Techno Research Co., Ltd. on July 1, 2022.