Data Download Available: Case Studies of Thermal Analysis (DSC/TG/DMA/TMA) Volume 4
Analysis and measurement methods of hardening characteristics! We introduce numerous examples using DSC, TG, DMA, and TMA. Please download the materials for more details.
In this case study collection, we will introduce examples related to "thermal analysis." Starting with the analysis case of "curing property analysis of resins by thermal analysis," we will also cover the objectives, methods, and results of "high-resolution TG measurement methods (quasi-isothermal and quasi-isobaric weight measurement)," as well as the objectives, methods, and results of "glass transition measurement of PE by dynamic viscoelastic measurement." Additionally, we will present analysis results, measurement data, simulation results, and more. We encourage you to read through it. [Contents] ■ Curing property analysis of resins by thermal analysis ■ High-resolution TG measurement methods (quasi-isothermal and quasi-isobaric weight measurement) ■ Glass transition measurement of PE by dynamic viscoelastic measurement ■ Measurement of the firing process of clay using high-temperature TMA *Other cases are also available. Please contact us, and we will send them to you.
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【Details of the Publication (Excerpt)】 ■Analysis of Resin Curing Characteristics by Thermal Analysis ・Analysis Case Studies ■High-Resolution TG Measurement Method (Quasi-Isothermal and Quasi-Isobaric Weight Measurement) ・Objective: Clearly measure weight changes due to dehydration reactions in gypsum ・Method: Thermogravimetric Measurement (TG) ・Results: Confirmed improvements in the resolution of weight changes *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Seiko Future Creation Co., Ltd. conducts business centered on contract analysis services, research and development, production technology, and FA systems, providing various services aimed at solving customer challenges. Regarding contract analysis, we have a proven track record of solving issues in the development, manufacturing, and quality assurance processes within the Seiko Group, allowing us to respond comprehensively by anticipating the background in various situations. We can handle samples ranging from million-order to nano-order sizes based on our extensive analytical experience primarily in watches and ICs, as well as in printer-related fields. In particular, we tackle customer challenges "from multiple perspectives and comprehensively" using the following technologies: - Microfabrication using a focused ion beam (FIB) device - Thermal analysis of material properties using differential scanning calorimetry (DSC) and others - Observation of microstructure using scanning probe microscopy (AFM) and others - Surface analysis using various devices (XPS, AES, GD-OES) - Cross-sectional observation and structural analysis using various devices (SEM, TEM) Our engineers are available for direct consultations. If you have any concerns, please feel free to reach out to us. *Seiko Future Creation Co., Ltd. changed its name from Seiko I-Techno Research Co., Ltd. on July 1, 2022.
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