We will introduce examples of surface analysis and measurements using various devices such as XPS, AES, and GD-OES, including measurements of Ni plating thickness, concentration, and surface contamination levels.
In this case study collection, we will introduce examples related to "surface analysis." We cover the objectives, methods, and results of "cleaning evaluation of plating substrates (GD-OES measurement)," as well as the features and analysis cases of "surface contamination analysis using XPS," and the characteristics and analysis cases of "analysis of iron rust (Raman spectroscopy)," among many others. Additionally, we present analysis results, condition analysis, composition measurements, and more. We encourage you to read it. [Contents] ■ Cleaning evaluation of plating substrates (GD-OES measurement) ■ Surface contamination analysis using XPS ■ Condition analysis of copper oxide (XPS/AES analysis) ■ Analysis of iron rust (Raman spectroscopy) ■ Composition investigation of discolored stainless steel *For more details, please refer to the PDF document or feel free to contact us.
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【Details of Publication (Excerpt)】 ■Cleaning Evaluation of Plated Substrates (GD-OES Measurement) ・Objective: Investigate the cleaning effect of substrates before the plating process ・Method: GD-OES (Glow Discharge Optical Emission Spectroscopy) ・Results: A reduction in the C element (carbon) on the surface of stainless steel substrates confirms the cleaning effect ■Surface Contamination Analysis by XPS 〈Features of XPS〉 ・Effective for analyzing surface contamination and discoloration, as well as evaluating surface treatments, since it provides elemental information from the very surface (a few nm) ・Not only can it identify elements, but it can also analyze the bonding states of the elements ・Analysis Examples *For more details, please refer to the PDF document or feel free to contact us.
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Seiko Future Creation Co., Ltd. conducts business centered on contract analysis services, research and development, production technology, and FA systems, providing various services aimed at solving customer challenges. Regarding contract analysis, we have a proven track record of solving issues in the development, manufacturing, and quality assurance processes within the Seiko Group, allowing us to respond comprehensively by anticipating the background in various situations. We can handle samples ranging from million-order to nano-order sizes based on our extensive analytical experience primarily in watches and ICs, as well as in printer-related fields. In particular, we tackle customer challenges "from multiple perspectives and comprehensively" using the following technologies: - Microfabrication using a focused ion beam (FIB) device - Thermal analysis of material properties using differential scanning calorimetry (DSC) and others - Observation of microstructure using scanning probe microscopy (AFM) and others - Surface analysis using various devices (XPS, AES, GD-OES) - Cross-sectional observation and structural analysis using various devices (SEM, TEM) Our engineers are available for direct consultations. If you have any concerns, please feel free to reach out to us. *Seiko Future Creation Co., Ltd. changed its name from Seiko I-Techno Research Co., Ltd. on July 1, 2022.