Introducing new heat dissipation technology in circuit board design! It is already widely adopted in various mass-produced circuit boards.
The miniaturization of devices, the high-frequency characteristics of circuits, and the increase in the current being handled have led to concerns about heat generation from the devices and circuits mounted on the substrate. This document provides detailed information on substrate design techniques that can accommodate everything from small-scale prototypes to mass production. We explain various new technologies for heat dissipation measures in substrate design. We encourage you to read it. 【Contents】 ■ Trends in devices ■ High heat dissipation measures for specific devices ■ Improving heat dissipation with surface structures ■ Metal core and metal base substrates ■ Thick copper substrates *For more details, please refer to the PDF document or feel free to contact us.
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【Purpose】 ■ Circuit design engineers, PCB design engineers *For more details, please refer to the PDF document or feel free to contact us.
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Morimar SSP Co., Ltd. is engaged in the development, manufacturing, processing, and sales of various synthetic resins and chemicals, as well as their raw materials. Utilizing the production systems of the Morimar Group both domestically and internationally, we are expanding our global initiatives across a wide range of products, including FRP raw materials and molded products, glass fibers, printed circuit boards, resin raw materials, and functional films, targeting markets both in Japan and abroad.